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LC75411ES

Onsemi

LC75411ES by Onsemi

LC75411ES by Onsemi is an Audio Control IC with 44 terminals in a square flatpack package. It operates b/w -40 to 85 °C, suitable for industrial use. With a power supply of 9V and max supply current of 40mA, it's ideal for audio applications requiring precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 471 parts In-Stock

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471

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Digiode

USA . 223 parts In-Stock

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223

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Distributors (Availability)

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Kulean Microsystems

USA . 7,315 parts In-Stock

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7,315

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Problanco Electronics

Mexico . 6,047 parts In-Stock

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6,047

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TANS Electronics

Latvia . 5,931 parts In-Stock

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SupplyDigital Components

Austria . 5,620 parts In-Stock

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5,620

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Kepictronics

USA . 3,300 parts In-Stock

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3,300

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Corphita

USA . 1,364 parts In-Stock

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UHIMA Technologies

Türkiye . 564 parts In-Stock

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Corohmni

South Africa . 354 parts In-Stock

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Overview

Enhance your audio control experience with the LC75411ES by Onsemi. Crafted with precision and quality, this innovative product offers unparalleled performance in a wide range of applications. From enhancing sound systems to optimizing audio output, this device is designed to elevate your audio experience to new heights. Trust in Onsemi's reputation for excellence and reliability, as they continue to deliver cutting-edge solutions to meet all your audio control needs. Upgrade your audio systems today with the LC75411ES and enjoy the seamless integration, superior functionality, and unmatched value it brings to every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides robustness and durability to the package, ensuring the product's longevity and reliability in various environmental conditions.

Surface Mount: YES

Surface mount capability makes installation and soldering of the product easier and more efficient, saving time and effort during the assembly process.

Power Supplies (V): 9

Operating at 9V allows the product to be compatible with a wide range of systems and applications, offering flexibility and versatility in usage.

No. of Terminals: 44

With a high number of terminals, the product can support complex audio control functions and interfaces, enabling advanced features and customization options.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the product to function effectively in cold climates or refrigerated settings without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, enhancing the efficiency and performance of the product.

Maximum Supply Current: 40 mA

With a maximum supply current of 40mA, the product operates efficiently and consumes minimal power, resulting in lower energy costs and longer battery life in portable devices.

Technical Specifications

Audio Control ICs LC75411ES attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G44

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.5SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Maximum Supply Current:

40 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LC75411ES General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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