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TDA7405

STMicroelectronics

TDA7405 by STMicroelectronics

TDA7405 by STMicroelectronics is a versatile audio control IC designed for tone control applications. It features 100 dB channel separation, 0.02% harmonic distortion, and operates within a -40 °C to 85°C range. Ideal for industrial audio systems, it supports dual channels with low-profile packaging.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,081 parts In-Stock

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6,081

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Anansix

USA . 2,730 parts In-Stock

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2,730

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Digiode

USA . 754 parts In-Stock

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754

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ComSIT Distribution GmbH

Germany . 21 parts In-Stock

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21

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,967 parts In-Stock

1+ parts

$2.041

100+ parts

-

1k+ parts

$1.837

10k+ parts

-

1,967

$2.041

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$1.837

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MKK Technologies

India . 22 parts In-Stock

1+ parts

$3.837

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-

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22

$3.837

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DigiPath Technology Company

USA . 22 parts In-Stock

1+ parts

$3.837

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22

$3.837

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Microchip USA

USA . 141 parts In-Stock

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$10.146

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141

$10.146

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AZTECH Wire

Italy . 595 parts In-Stock

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$15.270

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595

$15.270

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Corphita

USA . 4,130 parts In-Stock

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4,130

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,840 parts In-Stock

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$2.440

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1,840

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$2.440

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A-Z Elektronik GmbH

Germany . 783 parts In-Stock

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783

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Overview

Unlock exceptional audio quality with the TDA7405 from STMicroelectronics, a leader in innovative semiconductor solutions. This sleek, low-profile audio control IC ensures crystal-clear sound with impressive separation and minimal distortion, making it ideal for high-performance audio applications. Perfect for consumer electronics, automotive systems, and professional audio gear, the TDA7405 delivers unmatched reliability and superior performance, elevating your audio experience to new heights. Experience the difference with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly, resulting in reduced manufacturing costs and improved reliability.

Package Shape: SQUARE

The square package shape is efficient for board space utilization, allowing for more compact circuit designs without sacrificing performance.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, this IC provides enhanced audio quality, making it ideal for high-fidelity sound applications.

Channel Separation: 100 dB

A high channel separation ensures minimal crosstalk between audio channels, resulting in improved stereo sound quality.

Harmonic Distortion: 0.02 %

Low harmonic distortion means the audio output remains true to the original signal, providing clear and precise sound reproduction.

Power Supplies (V): 9

Operating at 9V provides a good balance between performance and power consumption, making it suitable for various audio applications.

No. of Terminals: 44

A higher number of terminals allows for more functionality and flexibility in circuit design, enabling comprehensive audio control features.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile design saves space on PCB layouts, conducive for modern compact electronic designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can function reliably in warmer environments, ensuring longevity and stability.

No. of Bands: 3

Three band equalization allows for precise audio tuning, enhancing user control over sound quality.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliable performance in extreme conditions, making it suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance, ensuring reliable connections and longevity of the device.

Terminal Position: QUAD

Quad terminal positions allow for versatile mounting options, enhancing design flexibility in PCB layout.

Maximum Seated Height: 1.6 mm

A low seated height allows for low-profile designs, contributing to slimmed-down electronic devices.

Width: 10 mm

A compact width facilitates easier integration into tight spaces within electronic systems.

Minimum Supply Voltage (Vsup): 7.5 V

The minimum supply voltage of 7.5V ensures compatibility with various power supply configurations, enhancing versatility.

Length: 10 mm

A length of 10 mm makes this IC suitable for small form factor designs where space is at a premium.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures means this IC is built to withstand harsh environments, ensuring durability and reliability.

No. of Channels: 2

With two channels, this IC supports stereo audio applications, catering to the needs of high-quality sound systems.

Terminal Form: GULL WING

The gull wing terminal form provides excellent mechanical support and is well-suited for automated soldering processes.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for increased density in component placement, making it suitable for compact circuits.

Maximum Supply Voltage (Vsup): 10.5 V

The maximum supply voltage of 10.5V accommodates a range of power sources, enhancing its application versatility.

Technical Specifications

Audio Control ICs TDA7405 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.02 %

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10.5 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7405 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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