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LV3327PV

Onsemi

LV3327PV by Onsemi

LV3327PV by Onsemi is a Volume Control Circuit IC with 16 terminals, operating at -40 to 85 °C. It has a power supply of 5V and uses BICMOS technology. Ideal for audio applications requiring precise volume control in industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,357 parts In-Stock

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Vyrian

USA . 1,568 parts In-Stock

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Kulean Microsystems

USA . 6,171 parts In-Stock

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Problanco Electronics

Mexico . 6,110 parts In-Stock

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SupplyDigital Components

Austria . 4,129 parts In-Stock

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TANS Electronics

Latvia . 2,153 parts In-Stock

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Corphita

USA . 810 parts In-Stock

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UHIMA Technologies

Türkiye . 761 parts In-Stock

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Corohmni

South Africa . 483 parts In-Stock

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Perfect Parts

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Overview

Enhance your audio experience with the LV3327PV from Onsemi, a leading manufacturer known for their quality and innovation in the field of Audio Control ICs. This small outline, shrink pitch volume control circuit offers superior performance and reliability, making it ideal for a wide range of applications. From home entertainment systems to automotive sound systems, this product provides precise control and excellent sound quality. Upgrade your audio devices today with the LV3327PV and enjoy the benefits of cutting-edge technology at an affordable price.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the audio control IC.

Surface Mount: YES

Being surface mountable makes the IC easy to install on a PCB, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular package shape is common and easy to work with, making it compatible with standard PCB layouts.

General IC Type: VOLUME CONTROL CIRCUIT

As a volume control circuit, this IC provides precise control over audio levels, making it suitable for audio applications where sound quality is important.

Power Supplies (V): 5

Operating at a low voltage of 5V makes this IC energy-efficient and suitable for a wide range of electronic devices.

No. of Terminals: 16

Having 16 terminals allows for flexibility in connectivity and functionality, enabling the IC to support various audio control features.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this IC can withstand prolonged use in industrial settings without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the IC can operate reliably in extreme cold environments.

Terminal Position: DUAL

Having dual terminal positions provides redundancy and enhances the reliability of the connections, reducing the risk of signal loss.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades means this IC is designed to perform consistently and reliably in harsh industrial environments.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption for efficient audio control.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections to the PCB, minimizing the risk of disconnection or signal distortion.

Terminal Pitch: 0.635 mm

The tight terminal pitch of 0.635mm enables compact packaging and allows for high density integration on the PCB, saving valuable space.

Technical Specifications

Audio Control ICs LV3327PV attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LV3327PV General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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