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LM4949TL/NOPB

Texas Instruments

LM4949TL/NOPB by Texas Instruments

LM4949TL/NOPB by Texas Instruments is a volume control circuit with 2 functions, operating at 3/5V. It features a grid array package style with 25 terminals and can withstand industrial temperature grades. Ideal for audio applications requiring precise volume control in compact designs.

Median Price

$1.500

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$1.340

1k+ parts

$1.200

10k+ parts

$1.130

500

-

$1.340

$1.200

$1.130

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.760

10k+ parts

-

250

-

-

$1.760

-

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.500

10k+ parts

$1.413

250

-

-

$1.500

$1.413

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,783 parts In-Stock

1+ parts

$1.406

100+ parts

-

1k+ parts

-

10k+ parts

-

1,783

$1.406

-

-

-

Mobius Materials

USA . 340 parts In-Stock

1+ parts

$4.874

100+ parts

$3.909

1k+ parts

-

10k+ parts

-

340

$4.874

$3.909

-

-

Vyrian

USA . 8,717 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,717

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-

-

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Anansix

USA . 1,853 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,853

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-

-

-

Euro-Tech

UK . 493 parts In-Stock

1+ parts

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10k+ parts

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493

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,058 parts In-Stock

1+ parts

$1.332

100+ parts

-

1k+ parts

-

10k+ parts

-

1,058

$1.332

-

-

-

Parana Technologies

USA . 1,369 parts In-Stock

1+ parts

$2.719

100+ parts

-

1k+ parts

$3.202

10k+ parts

-

1,369

$2.719

-

$3.202

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DigiPath Technology Company

USA . 1,282 parts In-Stock

1+ parts

$2.994

100+ parts

-

1k+ parts

-

10k+ parts

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1,282

$2.994

-

-

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IDEA Electronic Components Group

UK . 2,167 parts In-Stock

1+ parts

$3.055

100+ parts

-

1k+ parts

$2.750

10k+ parts

-

2,167

$3.055

-

$2.750

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ChromeModa Solutions

Germany . 2,156 parts In-Stock

1+ parts

$3.055

100+ parts

$2.505

1k+ parts

-

10k+ parts

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2,156

$3.055

$2.505

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QUARKTWIN TECHNOLOGY LTD

USA . 12,027 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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12,027

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Microchip USA

USA . 1,813 parts In-Stock

1+ parts

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1,813

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-

Overview

Experience superior audio control with the LM4949TL/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality audio control ICs that provide unmatched performance and reliability. Perfect for a wide range of applications, this volume control circuit offers customers value, benefits, and advantages like never before. Say goodbye to subpar sound quality and hello to a whole new level of audio excellence with the LM4949TL/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and heat resistance, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and space in the design.

No. of Functions: 2

Having 2 functions in one IC simplifies circuit design and reduces component count, leading to cost savings and improved reliability.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easier placement on the PCB, optimizing layout and design flexibility.

General IC Type: VOLUME CONTROL CIRCUIT

Being a volume control circuit, this IC provides precise and adjustable control over audio levels, enhancing user experience and audio quality.

Power Supplies (V): 3/5

Support for multiple power supply voltages (3V/5V) increases compatibility with different systems and applications, providing versatility and flexibility.

No. of Terminals: 25

Having 25 terminals allows for connectivity to various other components and peripherals, enabling integration with different parts of the system.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers high density and compactness, improving overall system efficiency and performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high temperature environments, ensuring reliable operation in harsh conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40°C makes this IC suitable for use in extreme cold environments, increasing versatility and usability.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance and reliability.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy and secure PCB mounting, improving overall stability and connection reliability.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures safe and efficient soldering during assembly, preventing damage to the IC.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this IC can withstand high-temperature reflow processes, ensuring proper soldering and connection integrity.

Temperature Grade: INDUSTRIAL

Being industrial grade, this IC is designed to operate reliably in demanding industrial environments, offering ruggedness and durability for critical applications.

Terminal Form: BALL

The ball terminal form provides strong mechanical bonding and high reliability, ensuring stable and secure connections for long-term performance.

Maximum Supply Current: 10.9 mA

With a maximum supply current of 10.9 mA, this IC is power-efficient, consuming minimal energy while delivering optimal performance, making it ideal for battery-operated devices.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm offers high density and compactness, enabling efficient PCB layout and space-saving design, improving overall system integration.

Technical Specifications

Audio Control ICs LM4949TL/NOPB attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

10.9 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LM4949TL/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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