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TDA7437

STMicroelectronics

TDA7437 by STMicroelectronics

TDA7437 by STMicroelectronics is a versatile audio control IC designed for tone control applications. It features 95 dB channel separation, 0.01% harmonic distortion, and operates within a supply voltage range of 6-10.2 V. Ideal for industrial audio systems, it ensures high-quality sound performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 4,288 parts In-Stock

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4,288

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Digiode

USA . 3,316 parts In-Stock

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3,316

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Anansix

USA . 1,627 parts In-Stock

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1,627

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Vyrian

USA . 774 parts In-Stock

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774

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Q Components

USA . 50 parts In-Stock

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50

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 897 parts In-Stock

1+ parts

$3.111

100+ parts

-

1k+ parts

$2.800

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897

$3.111

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$2.800

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MKK Technologies

India . 1,394 parts In-Stock

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$5.851

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1,394

$5.851

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DigiPath Technology Company

USA . 1,394 parts In-Stock

1+ parts

$5.851

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1,394

$5.851

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A-Z Elektronik GmbH

Germany . 6,347 parts In-Stock

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6,347

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Kepictronics

USA . 4,209 parts In-Stock

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4,209

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Corphita

USA . 1,568 parts In-Stock

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1,568

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Parana Technologies

USA . 1,006 parts In-Stock

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$3.720

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1,006

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$3.720

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Overview

Elevate your audio experience with the TDA7437 from STMicroelectronics, a leader in innovation and quality. This robust audio control IC offers exceptional performance and reliability, ensuring crystal-clear sound with minimal distortion. Perfect for various applications, from home theaters to automotive audio systems, it empowers you to fine-tune every note. Trust in STMicroelectronics for cutting-edge technology that enhances your auditory journey like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides reliable protection and ensures long-term performance in various environments.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and enables automation in assembly, which reduces manufacturing costs.

Package Shape: SQUARE

The square package shape simplifies layout design and improves space utilization on PCB designs.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, this IC enhances audio quality by allowing users to adjust the tonal balance in audio applications.

Channel Separation: 95 dB

High channel separation ensures clear and distinct audio channels, minimizing crosstalk and enhancing the listening experience.

Harmonic Distortion: 0.01%

Extremely low harmonic distortion guarantees high-quality audio reproduction, making this IC suitable for professional and consumer audio systems.

Power Supplies (V): 9

Designed to operate with standard 9V power supplies, ensuring compatibility with various audio devices.

No. of Terminals: 44

The presence of 44 terminals allows for versatile connectivity options, enabling complex circuit configurations.

Package Style (Meter): FLATPACK

The flatpack design allows for compact installations in smaller devices, favoring modern, space-saving designs.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature makes this IC suitable for use in high-temperature environments without performance degradation.

No. of Bands: 3

Having three bands allows for more precise audio adjustment, providing users with greater control over sound quality.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliability in extreme environments, making it ideal for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish offers excellent corrosion resistance and ensures good conductivity, enhancing the longevity of the connections.

Terminal Position: QUAD

Quad terminal configuration promotes easy routing and reduces the chances of errors in PCB designs.

Maximum Seated Height: 2.45 mm

A low maximum seated height helps in maintaining a slim profile for devices, contributing to the overall aesthetic and design.

Width: 10 mm

A compact width ensures the IC can fit easily into various designs, especially where space is at a premium.

Minimum Supply Voltage (Vsup): 6 V

A minimum supply voltage of 6V allows flexibility in power supply design, accommodating a range of applications.

Length: 10 mm

The short length contributes to a compact layout, facilitating integration into space-constrained devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges guarantees that the IC can perform reliably in demanding applications.

No. of Channels: 2

The dual channel design allows for stereo audio applications, making it perfect for consumer audio products.

Technology: BICMOS

The BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering excellent performance and lower power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide good mechanical strength, ensuring secure mounting on PCBs.

Maximum Supply Current: 13 mA

With a maximum supply current of just 13 mA, this IC is energy-efficient, making it suitable for battery-powered devices.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch aligns with modern PCB design standards, ensuring compatibility with advanced PCB layouts.

Maximum Supply Voltage (Vsup): 10.2 V

A maximum supply voltage of 10.2V adds flexibility in power supply design, allowing for a wide operational range.

Technical Specifications

Audio Control ICs TDA7437 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

95 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.5SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

13 mA

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7437 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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