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TDA7318

STMicroelectronics

TDA7318 by STMicroelectronics

TDA7318 by STMicroelectronics is an Audio Control IC with 2 channels, offering 103 dB channel separation and 0.09% harmonic distortion. Ideal for tone control circuits in industrial applications, it operates b/w -40 to 85 °C with a power supply range of 6-10V.

Median Price

$9.434

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 71 parts In-Stock

1+ parts

$1.428

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71

$1.428

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Voyager Components

USA . 2 parts In-Stock

1+ parts

$17.439

100+ parts

$17.439

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$17.439

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$17.439

2

$17.439

$17.439

$17.439

$17.439

Vyrian

USA . 7,712 parts In-Stock

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Digiode

USA . 1,362 parts In-Stock

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Anansix

USA . 1,246 parts In-Stock

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ABC Electronics Ltd.

UK . 15 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 12 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 3 parts In-Stock

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ECAB

Sweden . 1 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 485 parts In-Stock

1+ parts

$2.512

100+ parts

-

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$2.260

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485

$2.512

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$2.260

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MKK Technologies

India . 1,662 parts In-Stock

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$4.723

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$4.723

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DigiPath Technology Company

USA . 1,662 parts In-Stock

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$4.723

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$4.723

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AZTECH Wire

Italy . 681 parts In-Stock

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$12.590

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681

$12.590

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Microchip USA

USA . 342 parts In-Stock

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$16.159

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$16.159

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A-Z Elektronik GmbH

Germany . 6,516 parts In-Stock

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Parana Technologies

USA . 1,064 parts In-Stock

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$3.003

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$3.003

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Kepictronics

USA . 600 parts In-Stock

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600

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Corphita

USA . 172 parts In-Stock

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Assy Fe

Spain . 4 parts In-Stock

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Overview

Unleash the power of superior audio control with the TDA7318 by STMicroelectronics. This high-quality tone control circuit offers impeccable channel separation, minimal harmonic distortion, and a wide range of applications in the audio industry. With its industrial-grade technology and durable construction, this IC is designed to enhance your audio experience while providing unmatched value and benefits. Say goodbye to subpar sound quality and elevate your audio projects with the TDA7318 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product suitable for a wide range of applications.

Channel Separation: 103 dB

Excellent channel separation ensures clear audio output with minimal interference between channels, providing high-quality sound.

Harmonic Distortion: 0.09 %

Low harmonic distortion results in clean and accurate sound reproduction, delivering a more natural audio experience.

Power Supplies (V): 9

Operating at a voltage of 9V allows for efficient power consumption while still providing enough power for optimal performance.

No. of Terminals: 28

Increased number of terminals offer more connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can reliably operate in various environmental conditions without overheating.

No. of Bands: 2

Having 2 bands allows for more precise tonal control and customization of the audio output according to user preferences.

Minimum Supply Voltage (Vsup): 6 V

The minimum supply voltage of 6V ensures compatibility with a wide range of power sources, making the product versatile.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both Bipolar and CMOS technologies, offering high-speed performance and low power consumption.

Maximum Supply Current: 11 mA

Operating with a maximum supply current of 11 mA minimizes power usage and extends battery life in portable devices.

Technical Specifications

Audio Control ICs TDA7318 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

103 dB

General IC Type:

Harmonic Distortion:

.09 %

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e3

Length:

36.83 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Maximum Supply Current:

11 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TDA7318 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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