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LM48557TL

Texas Instruments

LM48557TL by Texas Instruments

LM48557TL by Texas Instruments is a volume control circuit with 16 terminals in a square grid array package. It operates b/w -40 to 85°C, with supply voltage ranging from 2.7V to 4.5V. Ideal for industrial applications requiring precise audio control in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,587 parts In-Stock

1+ parts

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8,587

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Digiode

USA . 4,479 parts In-Stock

1+ parts

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4,479

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Anansix

USA . 1,089 parts In-Stock

1+ parts

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1,089

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,715 parts In-Stock

1+ parts

$1.411

100+ parts

-

1k+ parts

$2.112

10k+ parts

-

1,715

$1.411

-

$2.112

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DigiPath Technology Company

USA . 245 parts In-Stock

1+ parts

$1.553

100+ parts

$1.429

1k+ parts

-

10k+ parts

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245

$1.553

$1.429

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IDEA Electronic Components Group

UK . 943 parts In-Stock

1+ parts

$1.585

100+ parts

-

1k+ parts

$1.426

10k+ parts

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943

$1.585

-

$1.426

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ChromeModa Solutions

Germany . 115 parts In-Stock

1+ parts

$1.585

100+ parts

$1.300

1k+ parts

-

10k+ parts

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115

$1.585

$1.300

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AZTECH Wire

Italy . 253 parts In-Stock

1+ parts

$10.060

100+ parts

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253

$10.060

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One Stop Electronics

USA . 502 parts In-Stock

1+ parts

$17.800

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502

$17.800

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Corphita

USA . 4,132 parts In-Stock

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4,132

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Overview

Enhance your audio experience with the LM48557TL by Texas Instruments, a high-quality Audio Control IC designed to deliver exceptional sound performance. Manufactured by industry leader Texas Instruments, this volume control circuit offers precision and reliability in a compact, square package. Ideal for a wide range of applications, this IC provides customers with improved audio control and enhanced functionality. Trust Texas Instruments for superior quality and choose the LM48557TL for all your audio control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good durability and protection for the IC, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying assembly processes.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, making it ideal for compact designs.

General IC Type: VOLUME CONTROL CIRCUIT

Designed specifically for volume control, this IC provides accurate and reliable audio adjustments.

No. of Terminals: 16

Having 16 terminals allows for a versatile connection setup, accommodating various input and output requirements.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high density mounting, enabling efficient use of PCB real estate and facilitating compact designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand rigorous use and perform reliably in demanding conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures makes this IC suitable for use in both extreme cold and hot environments.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure connections to the PCB, ensuring stability during operation.

Maximum Seated Height: 0.675 mm

Low seated height enables a slim profile design, making this IC suitable for compact electronic devices.

Width: 1.965 mm

Narrow width facilitates space-saving PCB layout designs, ideal for applications with limited space constraints.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement allows for compatibility with a wide range of power sources, enhancing flexibility in design.

Length: 1.965 mm

Compact length contributes to the overall small footprint of the IC, making it suitable for portable and space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh industrial environments, making it a robust choice for industrial applications.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, ensuring stable operation during handling and usage.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling compact designs and efficient use of PCB space.

Maximum Supply Voltage (Vsup): 4.5 V

High maximum supply voltage rating provides versatility in power source options, accommodating a wide range of voltage inputs.

Technical Specifications

Audio Control ICs LM48557TL attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B16

Length:

1.965 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.965 mm

Trade Compliance

LM48557TL General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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