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TDA7494

STMicroelectronics

TDA7494 by STMicroelectronics

TDA7494 by STMicroelectronics is a VOLUME CONTROL IC with 15 terminals, operating b/w 0-70 °C. It features 10% Harmonic Distortion, suitable for audio applications. With a supply voltage range of 11-35V and max current of 50mA, it is ideal for commercial-grade audio control circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,322 parts In-Stock

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3,322

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Digiode

USA . 1,216 parts In-Stock

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Anansix

USA . 755 parts In-Stock

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755

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LittleDiode

UK . 6 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 2 parts In-Stock

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Goldney Electronics S.L.

Spain . 2 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 846 parts In-Stock

1+ parts

$0.333

100+ parts

-

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$0.300

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846

$0.333

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$0.300

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MKK Technologies

India . 1,204 parts In-Stock

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$0.626

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$0.626

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DigiPath Technology Company

USA . 1,204 parts In-Stock

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$0.626

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1,204

$0.626

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$1.010

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$0.919

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$0.828

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500

$1.010

$0.919

$0.828

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Microchip USA

USA . 191 parts In-Stock

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$1.542

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191

$1.542

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Benley Electronics

USA . 2 parts In-Stock

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$1.750

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$1.750

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AZTECH Wire

Italy . 628 parts In-Stock

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$14.570

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Kepictronics

USA . 5,000 parts In-Stock

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Parana Technologies

USA . 820 parts In-Stock

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$0.398

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$0.398

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Corphita

USA . 411 parts In-Stock

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411

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Perfect Parts

USA . 112 parts In-Stock

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Overview

Elevate your audio experience with the TDA7494 from STMicroelectronics, a leading manufacturer known for its high-quality components. As part of the Audio Control ICs category, this volume control circuit offers unparalleled clarity and minimal distortion, ensuring a superior sound quality. Whether you're designing audio systems for home entertainment, automotive, or portable devices, the TDA7494 delivers exceptional performance and reliability. Upgrade your audio solutions today with the value and benefits that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to mount and integrate into various electronic devices.

General IC Type: VOLUME CONTROL CIRCUIT

This specific IC type is designed for volume control circuits, ensuring precise and reliable control of audio levels.

Harmonic Distortion: 10%

Low harmonic distortion of 10% ensures high-quality audio output without unwanted noise or interference.

No. of Terminals: 15

Having 15 terminals provides flexibility in connecting the IC to other components in the audio system.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure and stable mounting in electronic devices.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70 °C, this IC can withstand heat and perform reliably in various environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures the IC can function effectively even in cold conditions.

Terminal Position: ZIG-ZAG

The zig-zag terminal position facilitates easier soldering and connection to other components.

Minimum Supply Voltage (Vsup): 11 V

The minimum supply voltage of 11V ensures the IC receives sufficient power to operate efficiently.

Technology: BIPOLAR

Bipolar technology offers high accuracy and stability in volume control circuits, making this IC a reliable choice.

Maximum Supply Current: 50 mA

With a maximum supply current of 50mA, this IC consumes low power, making it energy-efficient.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm allows for compact design and space-saving in electronic devices.

Maximum Supply Voltage (Vsup): 35 V

The high maximum supply voltage of 35V provides flexibility in power supply options for the IC.

Technical Specifications

Audio Control ICs TDA7494 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

R-XZFM-T15

JESD-609 Code:

e0

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

ZIP

Package Equivalence Code:

ZIP15,.2,.17TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

11 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA7494 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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