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TDA7052AN

NXP Semiconductors

TDA7052AN by NXP Semiconductors

NXP Semiconductors' TDA7052AN is an audio control IC with 8 terminals, operating voltage of 4.5-18V, and max supply current of 12mA. It features a volume control circuit in a rectangular plastic/epoxy package suitable for industrial temperature grades. Ideal for applications requiring precise audio volume adjustments in compact setups.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 1,052 parts In-Stock

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Vyrian

USA . 1,049 parts In-Stock

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Digiode

USA . 497 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Sogenti Electronics

Canada . 8 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,260 parts In-Stock

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$0.540

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$0.540

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Corohmni

South Africa . 21 parts In-Stock

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$2.572

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Semicontronic

India . 1,592 parts In-Stock

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$4.800

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$4.680

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$4.656

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1,592

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Ampacity Inc.

Singapore . 148 parts In-Stock

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$5.800

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AZTECH Wire

Italy . 885 parts In-Stock

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$14.240

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One Stop Electronics

USA . 1,293 parts In-Stock

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$21.800

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A-Z Elektronik GmbH

Germany . 7,110 parts In-Stock

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Argo Parts USA

USA . 4,742 parts In-Stock

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Corphita

USA . 2,472 parts In-Stock

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UNI Independent Distributors

Spain . 2,412 parts In-Stock

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Perfect Parts

USA . 328 parts In-Stock

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328

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Continental Prestige Electronics

USA . 310 parts In-Stock

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310

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Enhance your audio experience with the TDA7052AN by NXP Semiconductors, a leading manufacturer known for top-quality audio control ICs. This compact volume control circuit, housed in a durable plastic package, offers customers the perfect balance of performance and reliability. Ideal for a variety of applications, this product ensures clear and powerful sound output while maintaining efficiency. Upgrade your audio systems today with the TDA7052AN and enjoy superior sound quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material helps in reducing weight and cost, making it a cost-effective choice.

General IC Type: VOLUME CONTROL CIRCUIT

Perfect for applications requiring volume control such as audio devices.

Maximum Operating Temperature: 85 °C

Can operate at higher temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate at low temperatures, making it versatile for various environments.

Technology: BIPOLAR

Bipolar technology offers high speed and precision, ideal for audio control applications.

Maximum Supply Voltage (Vsup): 18 V

Capable of handling higher supply voltages, making it suitable for a wide range of applications.

Technical Specifications

Audio Control ICs TDA7052AN attributes and parameters. Explore more Audio Control ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T8

Length:

9.5 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

6

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA7052AN General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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