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LM48557TLX

Texas Instruments

LM48557TLX by Texas Instruments

LM48557TLX by Texas Instruments is a volume control circuit with 16 terminals in a square package. It operates b/w -40°C to 85°C, suitable for industrial applications. With a supply voltage range of 2.7V to 4.5V, it's ideal for audio control ICs in compact devices requiring precise volume adjustments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,917 parts In-Stock

1+ parts

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2,917

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Anansix

USA . 1,726 parts In-Stock

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1,726

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Digiode

USA . 1,372 parts In-Stock

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1,372

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 337 parts In-Stock

1+ parts

$3.559

100+ parts

-

1k+ parts

$4.083

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337

$3.559

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$4.083

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ChromeModa Solutions

Germany . 4,574 parts In-Stock

1+ parts

$3.999

100+ parts

$3.279

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-

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4,574

$3.999

$3.279

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IDEA Electronic Components Group

UK . 975 parts In-Stock

1+ parts

$3.999

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$3.599

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975

$3.999

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$3.599

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AZTECH Wire

Italy . 782 parts In-Stock

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$11.014

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782

$11.014

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One Stop Electronics

USA . 1,183 parts In-Stock

1+ parts

$19.800

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1,183

$19.800

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Perfect Parts

USA . 6,509 parts In-Stock

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6,509

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Corphita

USA . 4,151 parts In-Stock

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4,151

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Alle Elektronik GmbH

Germany . 3,309 parts In-Stock

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3,309

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DigiPath Technology Company

USA . 1,137 parts In-Stock

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$3.605

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1,137

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$3.605

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Overview

Enhance your audio experience with the LM48557TLX by Texas Instruments! Crafted with precision and expertise, this Audio Control IC offers unparalleled quality and reliability. Designed for various applications in the audio industry, this product delivers exceptional value and benefits to customers. Whether you're looking to enhance your sound system at home or elevate your car audio setup, the LM48557TLX is the perfect choice. Trust Texas Instruments to provide you with cutting-edge technology that will take your audio experience to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good protection for the IC, ensuring longevity and reliable performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

General IC Type: VOLUME CONTROL CIRCUIT

Designed specifically for volume control, this IC is optimized for audio applications, ensuring precise and smooth volume adjustments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding industrial environments without compromising performance.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement makes this IC suitable for use in a variety of power-constrained applications while still delivering reliable performance.

Technical Specifications

Audio Control ICs LM48557TLX attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B16

Length:

1.965 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.965 mm

Trade Compliance

LM48557TLX General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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