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TPA0232PWPRG4

Texas Instruments

TPA0232PWPRG4 by Texas Instruments

TPA0232PWPRG4 by Texas Instruments is an Audio Control IC with 2 channels, 10% harmonic distortion, and 5V power supply. It is a CMOS technology volume control circuit suitable for industrial applications requiring precise audio adjustments in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,284 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,284

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Digiode

USA . 1,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,860

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,982 parts In-Stock

1+ parts

$1.456

100+ parts

$135.215

1k+ parts

$1.310

10k+ parts

-

1,982

$1.456

$135.215

$1.310

-

DigiPath Technology Company

USA . 402 parts In-Stock

1+ parts

$1.603

100+ parts

-

1k+ parts

-

10k+ parts

-

402

$1.603

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-

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ChromeModa Solutions

Germany . 1,061 parts In-Stock

1+ parts

$1.636

100+ parts

$1.342

1k+ parts

-

10k+ parts

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1,061

$1.636

$1.342

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-

IDEA Electronic Components Group

UK . 906 parts In-Stock

1+ parts

$1.636

100+ parts

-

1k+ parts

$1.472

10k+ parts

-

906

$1.636

-

$1.472

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One Stop Electronics

USA . 1,337 parts In-Stock

1+ parts

$4.800

100+ parts

-

1k+ parts

-

10k+ parts

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1,337

$4.800

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AZTECH Wire

Italy . 672 parts In-Stock

1+ parts

$6.853

100+ parts

-

1k+ parts

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10k+ parts

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672

$6.853

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Corphita

USA . 3,328 parts In-Stock

1+ parts

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3,328

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Overview

Enhance your audio experience with the TPA0232PWPRG4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers exceptional Audio Control ICs that are perfect for a wide range of applications. This Volume Control Circuit offers crystal-clear sound with minimal distortion, making it ideal for amplifiers, speakers, and other audio systems. With a small outline and thin profile package, this IC is easy to integrate into your design. Trust Texas Instruments to provide you with the best audio solutions on the market. Elevate your audio projects with the TPA0232PWPRG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight, durable, and cost-effective, making the product easy to handle and suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space in the overall design.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy integration into different electronic systems.

General IC Type: VOLUME CONTROL CIRCUIT

Volume control circuit enables precise adjustment of audio levels, enhancing user experience and audio quality.

Harmonic Distortion: 10%

Low harmonic distortion ensures high fidelity sound reproduction with minimum signal degradation.

Power Supplies (V): 5

Operating at 5V allows compatibility with standard power sources, making it convenient for use in various setups.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options and signal routing within the circuit.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the product to function in cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for increased flexibility in circuit layout and connection options.

Maximum Seated Height: 1.2 mm

Low seated height helps in reducing overall profile and size constraints in the design.

Width: 4.4 mm

Compact width facilitates space-saving integration in tight PCB layouts.

Minimum Supply Voltage (Vsup): 4.5 V

Having a low minimum supply voltage allows for efficient power management and use in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

A longer time at peak reflow temperature provides better solder joint integrity during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder melting and component reliability during assembly.

Length: 7.8 mm

Optimal length enables a balanced form factor for easy integration and space utilization in the circuit design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures consistent performance in harsh operating conditions.

No. of Channels: 2

Having 2 channels allows for dual audio input/output capabilities, suitable for stereo audio applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall circuit efficiency and performance.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and inspection during manufacturing processes.

Maximum Supply Current: 15 mA

Low maximum supply current requirement helps in reducing power consumption and heat dissipation in the system.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density mounting and space-saving layout on the PCB.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate sensitivity to moisture, ensuring proper handling and storage practices for the product.

Maximum Supply Voltage (Vsup): 5.5 V

Having a high maximum supply voltage allows for a wider input voltage range and compatibility with different power sources.

Technical Specifications

Audio Control ICs TPA0232PWPRG4 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Bands:

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TPA0232PWPRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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