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TPA0122PWPG4

Texas Instruments

TPA0122PWPG4 by Texas Instruments

TPA0122PWPG4 by Texas Instruments is a Volume Control Circuit IC with 2 channels, operating at 5V. It features a small outline package style and can handle industrial temperature grades from -40 to 85°C. Ideal for audio control applications requiring precise volume adjustments in compact setups.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,097 parts In-Stock

1+ parts

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7,097

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Digiode

USA . 1,099 parts In-Stock

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1,099

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 51 parts In-Stock

1+ parts

$2.572

100+ parts

-

1k+ parts

$3.062

10k+ parts

-

51

$2.572

-

$3.062

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ChromeModa Solutions

Germany . 3,009 parts In-Stock

1+ parts

$2.890

100+ parts

$2.370

1k+ parts

-

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3,009

$2.890

$2.370

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IDEA Electronic Components Group

UK . 1,404 parts In-Stock

1+ parts

$2.890

100+ parts

-

1k+ parts

$2.601

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1,404

$2.890

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$2.601

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AZTECH Wire

Italy . 248 parts In-Stock

1+ parts

$9.842

100+ parts

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248

$9.842

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One Stop Electronics

USA . 1,288 parts In-Stock

1+ parts

$17.800

100+ parts

-

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1,288

$17.800

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Component Stockers USA

USA . 560 parts In-Stock

1+ parts

$99.990

100+ parts

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560

$99.990

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Corphita

USA . 3,656 parts In-Stock

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3,656

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DigiPath Technology Company

USA . 1,695 parts In-Stock

1+ parts

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100+ parts

$2.606

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1,695

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$2.606

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Microchip USA

USA . 117 parts In-Stock

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117

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Overview

Enhance your audio experience with the TPA0122PWPG4 by Texas Instruments, a cutting-edge Volume Control Circuit designed to deliver top-notch performance and reliability. Manufactured with precision using high-quality materials, this Audio Control IC offers seamless integration and superior sound quality in a compact package. Ideal for a wide range of applications, this product is perfect for enhancing the audio output in your devices. Trust Texas Instruments to provide you with innovative solutions that exceed your expectations. Elevate your audio experience with the TPA0122PWPG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes it easier to integrate this IC onto circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and alignment on the circuit board, making installation more convenient.

Power Supplies (V): 5

Operating at 5V provides a standard power source that is compatible with many electronic devices and systems.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options and the potential for complex audio control configurations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand tough industrial conditions.

No. of Channels: 2

Having 2 channels means this IC can handle stereo audio signals, making it suitable for a wide range of audio control applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and efficient operation, making it a cost-effective choice.

Technical Specifications

Audio Control ICs TPA0122PWPG4 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Bands:

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

18 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TPA0122PWPG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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