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TDA7431S

STMicroelectronics

TDA7431S by STMicroelectronics

TDA7431S by STMicroelectronics is a BICMOS audio control IC featuring 90 dB channel separation and 0.01% harmonic distortion. It operates with a supply voltage of 7-10.2 V, making it ideal for tone control in audio applications. Its compact design fits easily into various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,651 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,651

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-

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Vyrian

USA . 1,652 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,652

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Digiode

USA . 1,112 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,112

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,374 parts In-Stock

1+ parts

$2.542

100+ parts

-

1k+ parts

$2.288

10k+ parts

-

1,374

$2.542

-

$2.288

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MKK Technologies

India . 1,614 parts In-Stock

1+ parts

$4.780

100+ parts

-

1k+ parts

-

10k+ parts

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1,614

$4.780

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DigiPath Technology Company

USA . 1,614 parts In-Stock

1+ parts

$4.780

100+ parts

-

1k+ parts

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10k+ parts

-

1,614

$4.780

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Parana Technologies

USA . 918 parts In-Stock

1+ parts

-

100+ parts

$3.039

1k+ parts

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918

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$3.039

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Corphita

USA . 840 parts In-Stock

1+ parts

-

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840

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Overview

Elevate your audio experience with the TDA7431S from STMicroelectronics, a leader in innovative technology. This advanced audio control IC delivers unmatched sound quality and precise tone control, making it ideal for high-fidelity applications in consumer electronics, automotive systems, and professional audio equipment. Enjoy exceptional performance with minimal distortion and superior channel separation, ensuring every note is crystal clear. Trust in STMicroelectronics’ reputation for excellence to transform your audio solutions into extraordinary experiences!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and lightweight characteristics, making it suitable for various audio applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCB designs, facilitating integration into compact audio systems.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit IC, it provides enhanced audio customization, allowing users to tailor sound profiles to their preferences.

Channel Separation: 90 dB

High channel separation of 90 dB minimizes crosstalk, resulting in more accurate stereo imaging and a better listening experience.

Harmonic Distortion: 0.01 %

Low harmonic distortion ensures clean audio output, making this IC a great choice for high-fidelity audio applications.

Power Supplies (V): 9

A standard supply voltage of 9V makes it easily compatible with a wide range of audio equipment.

No. of Terminals: 42

With 42 terminals, this IC offers extensive connectivity options, allowing for versatile circuit designs.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch package style minimizes board space and supports a streamlined layout for efficient designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can function effectively in warmer environments, ensuring reliability.

No. of Bands: 3

Offering three bands allows for detailed audio control, enhancing sound quality through adjustable frequency management.

Minimum Operating Temperature: 0 °C

A 0 °C minimum operating temperature ensures functionality in a range of environments, extending application possibilities.

Terminal Position: DUAL

Dual terminal positions simplify integration into various configurations, enhancing design flexibility.

Maximum Seated Height: 5.08 mm

With a maximum seated height of only 5.08 mm, it can be used in designs with strict height constraints.

Width: 15.24 mm

A compact width of 15.24 mm makes it suitable for space-constrained audio applications.

Minimum Supply Voltage (Vsup): 7 V

The ability to operate at a minimum supply voltage of 7V provides flexibility in power supply design.

Length: 36.83 mm

An appropriate length of 36.83 mm allows for standard PCB layouts, promoting design consistency.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures this IC is suitable for a wide variety of consumer audio applications.

No. of Channels: 2

Supporting two channels allows for stereo audio applications, enhancing playback capabilities.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS transistors, offering high performance and low power consumption.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust physical connections, improving reliability in diverse operating conditions.

Maximum Supply Current: 26 mA

A maximum supply current of 26 mA indicates low power consumption, making it energy-efficient for audio applications.

Terminal Pitch: 1.778 mm

The 1.778 mm terminal pitch allows for compatibility with a variety of PCB designs and manufacturing processes.

Maximum Supply Voltage (Vsup): 10.2 V

A maximum supply voltage of 10.2V allows the IC to operate under high performance with minimal risk of failure.

Technical Specifications

Audio Control ICs TDA7431S attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDIP-T42

Length:

36.83 mm

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP42,.6

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

26 mA

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TDA7431S General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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