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TDA7052ATD

NXP Semiconductors

TDA7052ATD by NXP Semiconductors

NXP Semiconductors' TDA7052ATD is a volume control circuit IC with 8 terminals, operating voltage range of 4.5V to 18V, and max supply current of 12mA. It is designed for industrial-grade applications requiring audio control in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 1,365 parts In-Stock

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Digiode

USA . 1,284 parts In-Stock

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Anansix

USA . 487 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Electronic Expediters

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A2Z Electronics, Inc.

USA . 25 parts In-Stock

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Nova Conductors

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Corohmni

South Africa . 84 parts In-Stock

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$3.243

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Aztec Data Supply Inc.

USA . 228 parts In-Stock

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$3.730

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$4.653

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$4.234

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$3.815

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Semicontronic

India . 1,401 parts In-Stock

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$5.800

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AZTECH Wire

Italy . 801 parts In-Stock

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One Stop Electronics

USA . 351 parts In-Stock

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Ampacity Inc.

Singapore . 628 parts In-Stock

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Continental Prestige Electronics

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Corphita

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UNI Independent Distributors

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Argo Parts USA

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Bastille Electronics

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Overview

Enhance your audio experience with the TDA7052ATD from NXP Semiconductors, a leading manufacturer in the industry. This high-quality Audio Control IC offers unparalleled performance and reliability for a wide range of applications. With a compact design and versatile features, this volume control circuit provides customers with exceptional value and benefits. Elevate your audio projects with the TDA7052ATD and enjoy superior sound quality like never before.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides a lightweight and durable housing for the IC, ensuring longevity and ease of handling.

Surface Mount:

YES - Allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape:

RECTANGULAR - Fits well into standard circuit designs, making it compatible with a wide range of applications.

General IC Type:

VOLUME CONTROL CIRCUIT - Offers precise control over audio levels, enabling optimal sound quality in various audio devices.

Power Supplies (V):

6 - Operates efficiently with a standard power supply, making it suitable for most electronic setups.

No. of Terminals:

8 - Provides multiple connection points for external components, allowing for versatile circuit configurations.

Package Style (Meter):

SMALL OUTLINE - Compact design saves space on the circuit board, ideal for constrained layouts.

Maximum Operating Temperature:

85 °C - Can withstand high temperatures, ensuring reliable performance in diverse environmental conditions.

Minimum Operating Temperature:

40 °C - Operates efficiently even in extreme cold temperatures, suitable for various industrial applications.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - Offers excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position:

DUAL - Allows for easy PCB layout and offers flexibility in circuit design.

Minimum Supply Voltage (Vsup):

4.5 V - Functions reliably with low supply voltage, suitable for battery-powered devices.

Temperature Grade:

INDUSTRIAL - Meets industry standards for temperature range and performance requirements, making it a dependable choice for industrial applications.

Technology:

BIPOLAR - Offers stable performance and low noise, ensuring high-quality audio output.

Terminal Form:

GULL WING - Facilitates easy soldering onto the PCB, simplifying the assembly process.

Maximum Supply Current:

12 mA - Requires low current to operate, conserving energy and reducing power consumption.

Terminal Pitch:

1.27 mm - Provides ample space for easy soldering and ensures proper connectivity with external components.

Maximum Supply Voltage (Vsup):

18 V - Handles high supply voltages, making it suitable for a wide range of electronic devices.

Technical Specifications

Audio Control ICs TDA7052ATD attributes and parameters. Explore more Audio Control ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

6

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TDA7052ATD General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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