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TDA7416

STMicroelectronics

TDA7416 by STMicroelectronics

TDA7416 by STMicroelectronics is a versatile audio control IC designed for equalization with 7 bands. It features excellent channel separation of 90 dB and low harmonic distortion at 0.05%. Ideal for industrial applications, it operates b/w -40 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,442 parts In-Stock

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1,442

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Digiode

USA . 789 parts In-Stock

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789

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Anansix

USA . 220 parts In-Stock

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220

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,286 parts In-Stock

1+ parts

$0.799

100+ parts

-

1k+ parts

$0.720

10k+ parts

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1,286

$0.799

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$0.720

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MKK Technologies

India . 1,318 parts In-Stock

1+ parts

$1.503

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1,318

$1.503

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DigiPath Technology Company

USA . 1,318 parts In-Stock

1+ parts

$1.503

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1,318

$1.503

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A-Z Elektronik GmbH

Germany . 2,286 parts In-Stock

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2,286

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GreenTree Electronics

Israel . 960 parts In-Stock

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960

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Parana Technologies

USA . 905 parts In-Stock

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$0.956

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905

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$0.956

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Corphita

USA . 625 parts In-Stock

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625

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Kepictronics

USA . 400 parts In-Stock

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400

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Overview

Experience superior sound quality with the TDA7416 from STMicroelectronics, a leader in innovative audio control solutions. This high-performance equalizer circuit enhances your audio applications, delivering crystal-clear sound and exceptional channel separation. Built for durability in diverse environments, it seamlessly integrates into various systems, offering unparalleled reliability and performance. Elevate your audio experience with the unmatched value and advantages of the TDA7416!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material is durable and lightweight, making it suitable for various applications while providing good protection.

Surface Mount: YES

Surface mount technology allows for smaller circuit designs, contributing to compact and efficient audio control systems.

Package Shape: SQUARE

The square package shape maximizes space utilization on PCB layouts, facilitating efficient integration into designs.

General IC Type: EQUALIZER CIRCUIT

As an equalizer circuit IC, it enhances audio performance by adjusting frequency responses, making it ideal for audio applications.

Channel Separation: 90 dB

High channel separation ensures minimal crosstalk between audio channels, resulting in clearer and more defined sound.

Harmonic Distortion: 0.05%

Low harmonic distortion ensures that the audio output is clean and faithful to the source material, enhancing overall audio quality.

Power Supplies (V): 9

A standard supply voltage simplifies integration into various systems and ensures compatibility with common power sources.

No. of Terminals: 44

With 44 terminals, this IC provides ample connectivity options for various configurations and additional functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack style is space-efficient, making it easier to fit into compact electronic assemblies.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature makes the IC suitable for industrial applications without performance degradation.

No. of Bands: 7

Having 7 bands allows for fine-tuning of audio frequencies, providing greater control over sound quality and user preference.

Minimum Operating Temperature: -40 °C

Operating in low temperatures ensures reliability in extreme environments, ideal for industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of connections.

Terminal Position: QUAD

Quad terminal positioning enables efficient routing on the PCB, allowing for better space management and signal integrity.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm allows for shallow mounting, beneficial for aesthetic and functional design constraints.

Width: 10 mm

Compact width fits well with space-constrained designs, providing flexibility in PCB layout.

Minimum Supply Voltage (Vsup): 7.5 V

Accepting a minimum of 7.5 V allows it to operate effectively with a variety of power levels, enhancing versatility.

Length: 10 mm

The 10 mm length further contributes to the compact footprint of the component, making it ideal for space-limited applications.

Temperature Grade: INDUSTRIAL

Offering an industrial temperature grade ensures reliability and stability across a wide range of operating conditions.

Terminal Form: GULL WING

Gull wing terminals provide a strong mechanical hold and are suitable for automated assembly processes, enhancing production efficiency.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for high-density PCB designs, vital for modern electronic devices requiring compact layouts.

Maximum Supply Voltage (Vsup): 10 V

The IC’s capability to handle a maximum supply voltage of 10 V ensures compatibility with a wide range of power systems and applications.

Technical Specifications

Audio Control ICs TDA7416 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

Harmonic Distortion:

.05 %

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Bands:

7

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7416 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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