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E-TDA7404DTR

STMicroelectronics

E-TDA7404DTR by STMicroelectronics

E-TDA7404DTR by STMicroelectronics is a versatile audio control IC designed for tone control applications. It features 100 dB channel separation, 0.05% harmonic distortion, and operates within a supply voltage range of 7.5V to 10.5V, making it ideal for industrial audio systems. Its compact SO package ensures easy integration in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,289 parts In-Stock

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4,289

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Anansix

USA . 2,458 parts In-Stock

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2,458

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Digiode

USA . 137 parts In-Stock

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137

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,144 parts In-Stock

1+ parts

$2.391

100+ parts

-

1k+ parts

$2.152

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1,144

$2.391

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$2.152

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MKK Technologies

India . 603 parts In-Stock

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$4.496

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603

$4.496

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DigiPath Technology Company

USA . 603 parts In-Stock

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$4.496

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603

$4.496

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AZTECH Wire

Italy . 578 parts In-Stock

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$13.350

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578

$13.350

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Microchip USA

USA . 4,398 parts In-Stock

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4,398

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Corphita

USA . 2,485 parts In-Stock

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Northwest PG Solutions

USA . 1,614 parts In-Stock

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Parana Technologies

USA . 968 parts In-Stock

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$2.859

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$2.859

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Native Components

USA . 489 parts In-Stock

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Overview

Elevate your audio experience with the E-TDA7404DTR from STMicroelectronics, a leader in innovation and reliability. This audio control IC offers exceptional sound quality with impressive channel separation and minimal distortion, making it perfect for a wide range of applications, from consumer electronics to automotive systems. Its durable design ensures optimal performance even in extreme conditions, providing you with unmatched value and peace of mind. Unlock superior sound today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing plastic/epoxy enhances durability and overall performance, making it a reliable choice for various audio applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern electronic systems.

Package Shape: RECTANGULAR

Rectangular shape facilitates better layout flexibility on PCBs, aiding space optimization.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, it provides superior sound quality adjustment, enhancing user experience.

Channel Separation: 100 dB

Exceptional channel separation minimizes crosstalk, ensuring clearer audio output.

Harmonic Distortion: 0.05 %

0.05% harmonic distortion guarantees that audio signals remain clear and faithful to the original recording.

Power Supplies (V): 9

Supports a standard 9V supply, making it versatile for a range of devices and applications.

No. of Terminals: 28

A 28-terminal configuration offers extensive connectivity options for more complex applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained designs, maintaining compactness.

Maximum Operating Temperature: 85 °C

Rated for operation up to 85 °C, it is suitable for industrial environments where heat management is crucial.

No. of Bands: 2

Having two bands allows for effective tone shaping, giving users better control over audio output.

Minimum Operating Temperature: -40 °C

Operational from a low temperature of -40 °C ensures reliability in extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances solderability and long-term reliability of the connections.

Terminal Position: DUAL

Dual terminal position enables flexibility in PCB design and routing, simplifying assembly.

Maximum Seated Height: 2.65 mm

A low maximum seated height aids in achieving low-profile designs that can fit in tight spaces.

Width: 7.5 mm

With a width of just 7.5 mm, it is compact enough for high-density applications.

Minimum Supply Voltage (Vsup): 7.5 V

Minimum supply voltage of 7.5V allows for broader compatibility with various power supplies.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds is optimal for ensuring proper solder joining without damaging the IC.

Peak Reflow Temperature °C: 250

The robust peak reflow temperature of 250 °C ensures compatibility with high-temperature soldering processes.

Length: 17.9 mm

A 17.9 mm length contributes to a compact package, ideal for modern electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade enhances reliability and performance in demanding environments.

Technology: BICMOS

BICMOS technology combines high-speed and low-power features, making it efficient for audio applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and reliable solder joints.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard, facilitating easier PCB layout and integration.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, allowing for easier handling and storage.

Maximum Supply Voltage (Vsup): 10.5 V

Supports a maximum supply voltage of 10.5V, providing flexibility for higher power applications.

Technical Specifications

Audio Control ICs E-TDA7404DTR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.05 %

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Bands:

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10.5 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

E-TDA7404DTR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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