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E-TDA7404D

STMicroelectronics

E-TDA7404D by STMicroelectronics

E-TDA7404D by STMicroelectronics is a dual-channel tone control IC designed for audio applications. It features 100 dB channel separation, 0.05% harmonic distortion, and operates within a supply voltage range of 7.5V to 10.5V. Ideal for industrial audio systems, it ensures high-quality sound performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,586 parts In-Stock

1+ parts

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2,586

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Anansix

USA . 2,497 parts In-Stock

1+ parts

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2,497

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Digiode

USA . 1,495 parts In-Stock

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1,495

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 855 parts In-Stock

1+ parts

$0.114

100+ parts

-

1k+ parts

$0.103

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-

855

$0.114

-

$0.103

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Native Components

USA . 399 parts In-Stock

1+ parts

$0.166

100+ parts

-

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-

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$0.159

399

$0.166

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$0.159

Northwest PG Solutions

USA . 1,176 parts In-Stock

1+ parts

$0.182

100+ parts

-

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$0.161

1,176

$0.182

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$0.161

MKK Technologies

India . 1,438 parts In-Stock

1+ parts

$0.215

100+ parts

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1,438

$0.215

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DigiPath Technology Company

USA . 1,438 parts In-Stock

1+ parts

$0.215

100+ parts

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1,438

$0.215

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Microchip USA

USA . 1,557 parts In-Stock

1+ parts

$5.135

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1,557

$5.135

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AZTECH Wire

Italy . 907 parts In-Stock

1+ parts

$18.110

100+ parts

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907

$18.110

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Corphita

USA . 3,451 parts In-Stock

1+ parts

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3,451

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Parana Technologies

USA . 2,160 parts In-Stock

1+ parts

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$0.136

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2,160

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$0.136

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Overview

Elevate your audio experience with the E-TDA7404D from STMicroelectronics, a leading name in innovation and quality. This audio control IC delivers exceptional performance with an impressive channel separation of 100 dB, ensuring crystal-clear sound for various applications, from home theater systems to professional audio equipment. Benefit from its compact design and superior reliability, making it the ideal choice for any audio enthusiast looking to achieve unparalleled sound fidelity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology leads to reduced assembly space and allows for automated manufacturing processes, enhancing production efficiency.

Package Shape: RECTANGULAR

The rectangular shape allows for versatile board layouts and efficient use of space on the PCB.

General IC Type: TONE CONTROL CIRCUIT

This IC is designed for tone control, providing enhanced audio performance and customization, ideal for high-quality audio applications.

Channel Separation: 100 dB

High channel separation ensures minimal crosstalk between channels, delivering clearer and more defined stereo sound.

Harmonic Distortion: 0.05 %

Low harmonic distortion indicates high fidelity audio reproduction, preserving the quality of the original sound.

Power Supplies (V): 9

Supports a standard voltage supply, facilitating easy integration into existing systems.

No. of Terminals: 28

A higher number of terminals allows for greater connectivity options, accommodating complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact design, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is reliable for use in various thermal conditions often found in industrial applications.

No. of Bands: 2

Two-band control allows for precise tuning of audio signals, enhancing user experience through better sound customization.

Minimum Operating Temperature: -40 °C

The extended temperature range makes it suitable for installation in harsh environments, ensuring reliable performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish ensures excellent corrosion resistance and enhances the longevity of electrical connections.

Terminal Position: DUAL

Dual terminal position facilitates better routing options on PCB and simplifies the mounting process.

Maximum Seated Height: 2.65 mm

The low profile aids in fitting into compact designs, particularly useful in slim devices.

Width: 7.5 mm

Narrow width allows for increased design flexibility and efficient use of PCB space.

Minimum Supply Voltage (Vsup): 7.5 V

Lower supply voltage demands makes it energy-efficient, reducing overall power consumption in audio systems.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized reflow time supports reliable solder joint formation, improving manufacturing reliability.

Peak Reflow Temperature °C: 250

Allows for compatibility with high-temperature solder processes, enhancing assembly robustness.

Length: 17.9 mm

A compact length makes it easy to integrate into various circuit designs without occupying excessive board space.

Temperature Grade: INDUSTRIAL

Industrial-grade rating signifying enhanced reliability and stability for critical applications under demanding conditions.

No. of Channels: 2

Dual-channel capability supports stereo audio applications, providing a richer audio experience.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS technologies, ensuring high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminals are designed for easy handling and soldering, enhancing assembly efficiency.

Terminal Pitch: 1.27 mm

Standard terminal pitch provides compatibility with a wide range of PCBs, simplifying the design process.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, appropriate for controlled environment storage and handling.

Maximum Supply Voltage (Vsup): 10.5 V

Higher supply voltage tolerance allows for flexibility in power supply selection, accommodating a range of applications.

Technical Specifications

Audio Control ICs E-TDA7404D attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.05 %

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10.5 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

E-TDA7404D General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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