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LM4918LQ

Texas Instruments

LM4918LQ by Texas Instruments

Texas Instruments' LM4918LQ is a 32-terminal audio control IC with 60 dB channel separation and operates on 5V. Ideal for volume control circuits, it features a quad terminal position, industrial temperature grade, and peak reflow temp of 235°C.

Median Price

$2.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Forefront Electronics and Design

USA . 3 parts In-Stock

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$2.080

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Vyrian

USA . 6,344 parts In-Stock

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Anansix

USA . 2,685 parts In-Stock

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Digiode

USA . 2,109 parts In-Stock

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Sea View Technologies

USA . 352 parts In-Stock

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Bristol Electronics

USA . 352 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 219 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,025 parts In-Stock

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$1.416

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$2.115

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$1.416

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ChromeModa Solutions

Germany . 4,406 parts In-Stock

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$1.591

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$1.305

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$1.591

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IDEA Electronic Components Group

UK . 603 parts In-Stock

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$1.591

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$1.432

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$1.591

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AZTECH Wire

Italy . 856 parts In-Stock

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$7.939

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$7.939

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One Stop Electronics

USA . 739 parts In-Stock

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$10.800

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Corphita

USA . 2,491 parts In-Stock

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Perfect Parts

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Kepictronics

USA . 405 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 219 parts In-Stock

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DigiPath Technology Company

USA . 193 parts In-Stock

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$1.434

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Overview

Experience superior audio control with the LM4918LQ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments provides top-of-the-line quality and reliability. This audio control IC offers exceptional channel separation, making it perfect for a wide range of applications. Whether you're looking to enhance your audio system or improve sound quality, the LM4918LQ delivers unmatched performance. Upgrade your audio experience today with this innovative volume control circuit.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and space-efficient integration onto circuit boards.

Channel Separation: 60 dB

High channel separation ensures clear and distinct sound output for each channel.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with a wide range of systems.

No. of Terminals: 32

Large number of terminals allow for versatile connectivity options.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without risk of damage.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments without risk of damage.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead finish provides good solderability for easy assembly.

Temperature Grade: INDUSTRIAL

Industrial grade temperature rating ensures reliability in demanding environments.

No. of Channels: 2

Dual channels provide stereo sound output for a better listening experience.

Technical Specifications

Audio Control ICs LM4918LQ attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

60 dB

General IC Type:

JESD-30 Code:

R-XQCC-N32

JESD-609 Code:

e0

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2X.24,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

LM4918LQ General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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