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LM48824TMX

Texas Instruments

LM48824TMX by Texas Instruments

LM48824TMX by Texas Instruments is a square-shaped audio amplifier IC with 16 terminals. It operates in industrial temperature range (-40 to 85°C) and supports 2 channels with a nominal output power of 0.037W. This package is designed for surface mount applications, featuring a very thin profile and fine pitch grid array suitable for compact audio devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,866 parts In-Stock

1+ parts

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2,866

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Vyrian

USA . 2,740 parts In-Stock

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2,740

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Digiode

USA . 1,569 parts In-Stock

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1,569

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 616 parts In-Stock

1+ parts

$1.545

100+ parts

-

1k+ parts

$2.194

10k+ parts

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616

$1.545

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$2.194

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DigiPath Technology Company

USA . 1,514 parts In-Stock

1+ parts

$1.701

100+ parts

$1.565

1k+ parts

-

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1,514

$1.701

$1.565

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ChromeModa Solutions

Germany . 2,835 parts In-Stock

1+ parts

$1.736

100+ parts

$1.424

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2,835

$1.736

$1.424

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IDEA Electronic Components Group

UK . 1,811 parts In-Stock

1+ parts

$1.736

100+ parts

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1k+ parts

$1.562

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1,811

$1.736

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$1.562

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AZTECH Wire

Italy . 851 parts In-Stock

1+ parts

$17.149

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851

$17.149

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One Stop Electronics

USA . 1,596 parts In-Stock

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$21.800

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1,596

$21.800

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Corphita

USA . 4,869 parts In-Stock

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4,869

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Overview

Elevate your audio experience with the LM48824TMX by Texas Instruments. Crafted with precision and expertise, this audio amplifier offers unparalleled sound quality and performance. Designed for a wide range of applications, this product delivers exceptional value and benefits to customers seeking top-notch audio control ICs. With its innovative features and reliable performance, the LM48824TMX is the perfect solution for all your audio needs. Trust Texas Instruments for cutting-edge technology and superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliable performance in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Package Shape: SQUARE

Square package shape ensures compact design and efficient use of space in electronic devices.

General IC Type: AUDIO AMPLIFIER

Being an audio amplifier IC, this product is specifically designed to enhance and amplify audio signals.

No. of Terminals: 16

With 16 terminals, this IC provides a sufficient number of connections for enhanced functionality.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile and fine pitch enables high-density mounting on PCBs for space-saving designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high-temperature environments.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliability in various environments.

Nominal Output Power: 0.037 W

With a nominal output power of 0.037 W, this IC provides adequate power for audio amplification applications.

Width: 1.69 mm

The narrow width of 1.69 mm allows for space-efficient integration into electronic devices.

Minimum Supply Voltage (Vsup): 2.4 V

The low minimum supply voltage requirement of 2.4 V ensures compatibility with a wide range of power sources.

Length: 1.69 mm

The compact length of 1.69 mm further enhances the space-saving design of this IC.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding industrial applications.

No. of Channels: 2

With 2 channels, this IC can handle stereo audio signals for enhanced audio output.

Terminal Form: BALL

The ball terminal form provides secure connections and facilitates easy soldering during installation.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4 mm allows for high-density mounting and efficient connection within the circuit.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources while providing sufficient power for operation.

Technical Specifications

Audio Control ICs LM48824TMX attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B16

Length:

1.69 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.037 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.69 mm

Trade Compliance

LM48824TMX General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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