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TS4851EIJT

STMicroelectronics

TS4851EIJT by STMicroelectronics

TS4851EIJT by STMicroelectronics is a volume control IC designed for audio applications, featuring low harmonic distortion at 1%. It operates b/w 3.3V and 5V with a max current of 11mA, suitable for industrial use in compact designs. Its thin profile and fine pitch make it ideal for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,883 parts In-Stock

1+ parts

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4,883

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Digiode

USA . 2,671 parts In-Stock

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2,671

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Anansix

USA . 1,055 parts In-Stock

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1,055

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,703 parts In-Stock

1+ parts

$1.766

100+ parts

-

1k+ parts

$1.590

10k+ parts

-

1,703

$1.766

-

$1.590

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MKK Technologies

India . 840 parts In-Stock

1+ parts

$3.322

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-

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-

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840

$3.322

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DigiPath Technology Company

USA . 840 parts In-Stock

1+ parts

$3.322

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-

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840

$3.322

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Microchip USA

USA . 132 parts In-Stock

1+ parts

$6.403

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132

$6.403

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Ampacity Inc.

Singapore . 1,045 parts In-Stock

1+ parts

$10.800

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1,045

$10.800

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Component Stockers USA

USA . 686 parts In-Stock

1+ parts

$99.990

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686

$99.990

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A-Z Elektronik GmbH

Germany . 5,339 parts In-Stock

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5,339

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Kepictronics

USA . 5,075 parts In-Stock

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5,075

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Assy Fe

Spain . 4,880 parts In-Stock

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4,880

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Vigor

Singapore . 4,800 parts In-Stock

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4,800

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Corphita

USA . 4,743 parts In-Stock

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4,743

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 837 parts In-Stock

1+ parts

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$2.112

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837

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$2.112

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Overview

Elevate your audio applications with the TS4851EIJT from STMicroelectronics—a trusted leader in semiconductor innovation. Designed for precision volume control, this compact and robust audio control IC delivers exceptional performance with minimized distortion. Its industrial-grade reliability ensures seamless integration across a range of devices, while its energy efficiency enhances your product's longevity. Choose quality, choose STMicroelectronics, and unlock superior audio experiences!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and protection against environmental factors, making this product suitable for a range of applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards, enhancing overall efficiency in space usage.

Package Shape: RECTANGULAR

The rectangular form factor aids in efficient board layout and provides flexibility in design for various applications.

General IC Type: VOLUME CONTROL CIRCUIT

Specialized as a volume control circuit, this IC is ideal for audio applications, ensuring precise sound management.

Harmonic Distortion: 1 %

A low harmonic distortion value indicates high audio fidelity, making this product a great choice for high-quality sound systems.

Power Supplies (V): 3.3/5

Compatible with both 3.3V and 5V power supplies, it offers flexibility for integration in different electronic designs.

No. of Terminals: 18

With 18 terminals, this IC supports comprehensive connectivity options, facilitating versatile application in audio setups.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile allows for high density on the PCB, making this IC suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in various environmental conditions and industrial applications.

Minimum Operating Temperature: -40 °C

With a range down to -40 °C, this IC is reliable for use in extreme climates, making it suitable for outdoor and industrial applications.

Terminal Position: BOTTOM

Bottom terminal positioning can help with compact integration within the circuit layout while optimizing signal integrity.

Maximum Seated Height: 0.63 mm

The low seated height facilitates a sleek design and minimizes space requirements on the printed circuit board.

Width: 2.17 mm

A slim width profile allows for close placement of components on the PCB, enhancing circuit efficiency and design flexibility.

Minimum Supply Voltage (Vsup): 3 V

Operating down to 3V minimizes power consumption, making it energy-efficient for battery-operated devices.

Length: 2.44 mm

Short length allows for compact placement in space-restricted environments, ideal for portable electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures durability and reliable performance in harsh conditions, meeting the demands of commercial applications.

No. of Channels: 2

Supporting two channels enables stereo audio processing, essential for high-quality audio systems.

Terminal Form: BALL

Ball terminal form allows for reliable solder joints, enhancing connectivity and overall product reliability.

Maximum Supply Current: 11 mA

With a maximum supply current of 11 mA, this IC maintains low power consumption while delivering efficient performance.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch provides compatibility with fine-pitch PCB designs, supporting advanced electronic circuit requirements.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a high maximum supply voltage of 5.5V expands the versatility of this IC in various audio applications.

Technical Specifications

Audio Control ICs TS4851EIJT attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

General IC Type:

Harmonic Distortion:

1 %

JESD-30 Code:

R-PBGA-B18

Length:

2.44 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FLIP CHIP

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

.63 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

11 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.17 mm

Trade Compliance

TS4851EIJT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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