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TPA6030A4PWP

Texas Instruments

TPA6030A4PWP by Texas Instruments

TPA6030A4PWP by Texas Instruments is a Volume Control Circuit with 110 dB Channel Separation and 10% Harmonic Distortion. Ideal for audio applications, it operates at temperatures from -40 to 85 °C with a supply voltage range of 7-15 V.

Median Price

$4.351

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,475 parts In-Stock

1+ parts

$4.810

100+ parts

$4.214

1k+ parts

$2.381

10k+ parts

-

11,475

$4.810

$4.214

$2.381

-

Mouser Electronics

USA . 64 parts In-Stock

1+ parts

$6.160

100+ parts

$3.970

1k+ parts

$3.660

10k+ parts

-

64

$6.160

$3.970

$3.660

-

Rochester

USA . 4,633 parts In-Stock

1+ parts

-

100+ parts

$3.230

1k+ parts

$2.890

10k+ parts

$2.720

4,633

-

$3.230

$2.890

$2.720

DigiKey

USA . 4,633 parts In-Stock

1+ parts

-

100+ parts

$4.250

1k+ parts

-

10k+ parts

-

4,633

-

$4.250

-

-

Verical

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

$4.037

1k+ parts

$3.612

10k+ parts

$3.400

2,800

-

$4.037

$3.612

$3.400

Arrow

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$4.452

1k+ parts

$4.050

10k+ parts

$3.978

50

-

$4.452

$4.050

$3.978

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,138 parts In-Stock

1+ parts

$3.144

100+ parts

-

1k+ parts

-

10k+ parts

-

2,138

$3.144

-

-

-

Vyrian

USA . 2,396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,396

-

-

-

-

SPM Sales

USA . 45 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

45

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,047 parts In-Stock

1+ parts

$0.219

100+ parts

-

1k+ parts

$1.521

10k+ parts

-

1,047

$0.219

-

$1.521

-

DigiPath Technology Company

USA . 1,686 parts In-Stock

1+ parts

$0.241

100+ parts

$0.222

1k+ parts

-

10k+ parts

-

1,686

$0.241

$0.222

-

-

IDEA Electronic Components Group

UK . 2,376 parts In-Stock

1+ parts

$0.246

100+ parts

-

1k+ parts

$0.221

10k+ parts

-

2,376

$0.246

-

$0.221

-

ChromeModa Solutions

Germany . 2,214 parts In-Stock

1+ parts

$0.246

100+ parts

$0.202

1k+ parts

-

10k+ parts

-

2,214

$0.246

$0.202

-

-

Corphita

USA . 2,881 parts In-Stock

1+ parts

$2.979

100+ parts

-

1k+ parts

-

10k+ parts

-

2,881

$2.979

-

-

-

Microchip USA

USA . 1,261 parts In-Stock

1+ parts

$22.360

100+ parts

$22.220

1k+ parts

$22.150

10k+ parts

$22.080

1,261

$22.360

$22.220

$22.150

$22.080

A-Z Elektronik GmbH

Germany . 4,842 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,842

-

-

-

-

Overview

Enhance your audio control experience with the TPA6030A4PWP by Texas Instruments, a top-tier manufacturer known for delivering quality ICs. Designed for various applications in the audio industry, this volume control circuit offers exceptional channel separation and low harmonic distortion, ensuring crystal-clear sound output. With its compact rectangular shape and surface mount capability, this product is not only easy to integrate but also provides a seamless user experience. Elevate your audio projects with the TPA6030A4PWP and enjoy superior performance, reliability, and value that Texas Instruments is renowned for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the IC, making it suitable for various applications.

Channel Separation: 110 dB

High channel separation ensures clear and distinct audio signals, resulting in a high-quality sound output.

Power Supplies (V): 12

Operating at 12V allows for efficient power utilization and compatibility with a range of systems.

Nominal Output Power: 3 W

With a nominal output power of 3W, this IC can deliver decent audio output for a variety of applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh environments.

No. of Channels: 2

Dual-channel design allows for stereo sound output, enhancing the overall audio experience.

Maximum Supply Voltage (Vsup): 15 V

With a maximum supply voltage of 15V, this IC offers flexibility in power input options.

Technical Specifications

Audio Control ICs TPA6030A4PWP attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

110 dB

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

4

Nominal Noise Figure:

102.5 dB

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

3 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

26 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TPA6030A4PWP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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