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TDA7719TR

STMicroelectronics

TDA7719TR by STMicroelectronics

TDA7719TR by STMicroelectronics is a BICMOS audio control IC with 3 tone control bands, 90 dB channel separation, and operates b/w -40 to 85°C. It has 2 channels, requires 7.5-10V power supply, and comes in a small outline package suitable for industrial applications.

Median Price

$2.310

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.310

100+ parts

-

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100

$2.310

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Chip Stock

USA . 89,920 parts In-Stock

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89,920

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Vyrian

USA . 3,463 parts In-Stock

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3,463

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Digiode

USA . 2,395 parts In-Stock

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2,395

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Anansix

USA . 404 parts In-Stock

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404

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Cyclops Electronics Ltd

UK . 281 parts In-Stock

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281

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,434 parts In-Stock

1+ parts

$2.398

100+ parts

-

1k+ parts

$2.158

10k+ parts

-

1,434

$2.398

-

$2.158

-

MKK Technologies

India . 646 parts In-Stock

1+ parts

$4.508

100+ parts

-

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646

$4.508

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DigiPath Technology Company

USA . 646 parts In-Stock

1+ parts

$4.508

100+ parts

-

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646

$4.508

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Microchip USA

USA . 4,392 parts In-Stock

1+ parts

$15.020

100+ parts

$14.920

1k+ parts

$14.880

10k+ parts

$14.830

4,392

$15.020

$14.920

$14.880

$14.830

AZTECH Wire

Italy . 1,084 parts In-Stock

1+ parts

$16.890

100+ parts

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1,084

$16.890

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Ampacity Inc.

Singapore . 47,206 parts In-Stock

1+ parts

$17.800

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47,206

$17.800

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RC Electronics

USA . 45,069 parts In-Stock

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45,069

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Lixinc

USA . 19,487 parts In-Stock

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19,487

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A-Z Elektronik GmbH

Germany . 7,476 parts In-Stock

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7,476

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Epart123

USA . 5,000 parts In-Stock

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$3.520

10k+ parts

$3.520

5,000

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$3.520

$3.520

iodParts Technologies Inc.

India . 4,380 parts In-Stock

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4,380

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Corphita

USA . 4,312 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 1,270 parts In-Stock

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1,270

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Parana Technologies

USA . 999 parts In-Stock

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$2.867

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999

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$2.867

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Perfect Parts

USA . 207 parts In-Stock

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207

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$2.264

1k+ parts

$2.194

10k+ parts

$2.148

50

-

$2.264

$2.194

$2.148

Overview

Enhance your audio experience with the TDA7719TR by STMicroelectronics. Crafted with precision and quality, this audio control IC offers impeccable tone control with 3 bands and 90 dB channel separation. Perfect for industrial applications, this small outline IC provides dual terminal positions and a wide operating temperature range from -40°C to 85°C. Elevate your sound system with the value and benefits of the TDA7719TR, ensuring superior performance and reliability for all your audio needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making this product a reliable choice for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for mass production.

Channel Separation: 90 dB

With high channel separation of 90 dB, this product ensures clear and distinct audio output for enhanced sound quality.

Power Supplies (V): 8.5

Operating at 8.5V, this product offers a stable power supply for consistent performance.

No. of Terminals: 28

With 28 terminals, this product provides multiple connection points for versatile integration within audio systems.

Technology: BICMOS

Utilizing BICMOS technology, this product combines the benefits of both bipolar and CMOS technologies for improved functionality and efficiency.

Technical Specifications

Audio Control ICs TDA7719TR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8.5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TDA7719TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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