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PGA2311UA/1KG4

Texas Instruments

PGA2311UA/1KG4 by Texas Instruments

PGA2311UA/1KG4 by Texas Instruments is a Volume Control Circuit IC with 2 channels, operating at -40 to 85°C. It has a supply voltage range of 4.75V to 5.25V and consumes up to 12mA current. Ideal for audio applications requiring precise volume control in industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,673 parts In-Stock

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3,673

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Digiode

USA . 2,956 parts In-Stock

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2,956

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Chip Stock

USA . 585 parts In-Stock

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585

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Nova Conductors

Japan . 25 parts In-Stock

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 347 parts In-Stock

1+ parts

$0.123

100+ parts

-

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$1.472

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347

$0.123

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$1.472

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DigiPath Technology Company

USA . 627 parts In-Stock

1+ parts

$0.135

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$0.124

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627

$0.135

$0.124

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IDEA Electronic Components Group

UK . 2,300 parts In-Stock

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$0.138

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$0.124

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2,300

$0.138

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$0.124

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ChromeModa Solutions

Germany . 1,114 parts In-Stock

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$0.138

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$0.113

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$0.138

$0.113

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Corohmni

South Africa . 965 parts In-Stock

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$3.138

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965

$3.138

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$3.546

100+ parts

$3.369

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$3.369

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50

$3.546

$3.369

$3.369

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One Stop Electronics

USA . 505 parts In-Stock

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$5.800

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505

$5.800

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AZTECH Wire

Italy . 749 parts In-Stock

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$8.799

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749

$8.799

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Semicontronic

India . 719 parts In-Stock

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$18.800

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$18.330

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$18.236

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719

$18.800

$18.330

$18.236

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Ampacity Inc.

Singapore . 213 parts In-Stock

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$20.800

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213

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Continental Prestige Electronics

USA . 3,398 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Corphita

USA . 1,866 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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900

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Bastille Electronics

Australia . 47 parts In-Stock

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47

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Argo Parts USA

USA . 12 parts In-Stock

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12

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Overview

Elevate your audio experience with the PGA2311UA/1KG4 from Texas Instruments. This top-of-the-line audio control IC offers unparalleled quality and reliability, backed by the reputable manufacturer's expertise in the industry. Ideal for a wide range of applications in audio systems, this volume control circuit delivers exceptional value with its precision performance and ease of use. Upgrade your sound system today with the PGA2311UA/1KG4 and enjoy the benefits of superior audio control like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in audio control ICs for its durability and protection against external elements.

Surface Mount: YES

Makes installation on printed circuit boards easier and more efficient.

General IC Type: VOLUME CONTROL CIRCUIT

Specifically designed for volume control applications, ensuring precise and accurate adjustment of audio levels.

Power Supplies (V): +-5

Suitable for various applications requiring a dual power supply of +/-5V.

Maximum Operating Temperature: 85 °C

Can operate reliably in high temperature environments without compromising performance.

No. of Terminals: 16

Provides multiple connection points for enhanced functionality and control.

Package Style (Meter): SMALL OUTLINE

Compact size saves space on the circuit board, ideal for designs with limited space.

Technology: CMOS

Uses CMOS technology known for its low power consumption and high noise immunity, ensuring efficiency and reliability.

Technical Specifications

Audio Control ICs PGA2311UA/1KG4 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.285 mm

Moisture Sensitivity Level (MSL):

2

No. of Bands:

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

PGA2311UA/1KG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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