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PGA2311UG4

Texas Instruments

PGA2311UG4 by Texas Instruments

PGA2311UG4 by Texas Instruments is an audio control IC with 2 channels and CMOS technology. It operates b/w -40 to 85°C, with a supply voltage range of 4.75V to 5.25V. This volume control circuit in a small outline package is ideal for industrial applications requiring precise audio adjustments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,819 parts In-Stock

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3,819

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Digiode

USA . 139 parts In-Stock

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139

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R&J Components

USA . 84 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 239 parts In-Stock

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$0.481

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239

$0.481

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Parana Technologies

USA . 704 parts In-Stock

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$2.952

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$3.453

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704

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ChromeModa Solutions

Germany . 3,926 parts In-Stock

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$3.317

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$2.720

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$3.317

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IDEA Electronic Components Group

UK . 1,258 parts In-Stock

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$3.317

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$2.985

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$2.985

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Semicontronic

India . 448 parts In-Stock

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$5.800

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$5.655

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$5.626

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448

$5.800

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$5.626

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Ampacity Inc.

Singapore . 765 parts In-Stock

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$7.800

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765

$7.800

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AZTECH Wire

Italy . 564 parts In-Stock

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$11.498

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One Stop Electronics

USA . 414 parts In-Stock

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$13.800

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Continental Prestige Electronics

USA . 5,788 parts In-Stock

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Argo Parts USA

USA . 4,498 parts In-Stock

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Corphita

USA . 1,091 parts In-Stock

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DigiPath Technology Company

USA . 932 parts In-Stock

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$2.991

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$2.991

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Microchip USA

USA . 354 parts In-Stock

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354

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Overview

Enhance your audio experience with the PGA2311UG4 by Texas Instruments, a top-of-the-line volume control circuit designed to deliver unparalleled sound quality and precision. Manufactured by industry leader Texas Instruments, this audio control IC boasts a compact package style and dual terminal position for easy integration into your audio system. Ideal for applications in industrial settings, the PGA2311UG4 offers customers the perfect balance of performance, reliability, and value. Upgrade your audio setup today with the PGA2311UG4 and immerse yourself in crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the IC, ensuring a longer lifespan.

Surface Mount : YES

Surface mount capability makes it easy to integrate this IC into electronic devices, saving space and simplifying assembly.

Package Shape : RECTANGULAR

Rectangular package shape allows for easy placement and layout within circuit designs.

Power Supplies (V) : +-5

Wide power supply range of +-5V allows for flexibility in different voltage applications.

No. of Terminals : 16

Having 16 terminals provides various connection options, enabling versatile use in different circuit configurations.

Maximum Operating Temperature : 85 °C

High maximum operating temperature of 85°C ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature : -40 °C

Low minimum operating temperature of -40°C allows for usage in a wide range of temperature environments.

Technology : CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable.

Technical Specifications

Audio Control ICs PGA2311UG4 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.285 mm

Moisture Sensitivity Level (MSL):

2

No. of Bands:

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

PGA2311UG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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