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TDA7309

STMicroelectronics

TDA7309 by STMicroelectronics

TDA7309 by STMicroelectronics is a BICMOS audio control IC with 2 channels, offering 100 dB channel separation and 0.01% harmonic distortion. It operates on a power supply of 6-10V, ideal for volume control circuits in industrial temperature environments. Package style is in-line with 20 terminals and matte tin finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,026 parts In-Stock

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5,026

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Digiode

USA . 3,902 parts In-Stock

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3,902

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Anansix

USA . 2,590 parts In-Stock

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2,590

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ComSIT USA

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,639 parts In-Stock

1+ parts

$2.184

100+ parts

-

1k+ parts

$1.966

10k+ parts

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1,639

$2.184

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$1.966

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Microchip USA

USA . 224 parts In-Stock

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$3.624

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224

$3.624

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MKK Technologies

India . 1,376 parts In-Stock

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$4.107

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1,376

$4.107

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DigiPath Technology Company

USA . 1,376 parts In-Stock

1+ parts

$4.107

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1,376

$4.107

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AZTECH Wire

Italy . 196 parts In-Stock

1+ parts

$11.880

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196

$11.880

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RC Electronics

USA . 5,000 parts In-Stock

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5,000

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A-Z Elektronik GmbH

Germany . 1,761 parts In-Stock

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1,761

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Corphita

USA . 1,235 parts In-Stock

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Parana Technologies

USA . 1,184 parts In-Stock

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$2.611

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1,184

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$2.611

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Kepictronics

USA . 600 parts In-Stock

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600

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Assy Fe

Spain . 34 parts In-Stock

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34

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Overview

Elevate your audio experience with the TDA7309 from STMicroelectronics, a leading manufacturer known for producing top-quality Audio Control ICs. This rectangular volume control circuit offers exceptional channel separation of 100 dB and minimal harmonic distortion of just 0.01%. With a wide operating temperature range and industrial-grade technology, this product is perfect for various applications where precise and high-quality audio control is essential. Trust in STMicroelectronics to deliver superior performance and reliability, making the TDA7309 a valuable choice for customers seeking unparalleled audio control solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to environmental factors, ensuring long-term reliability.

Channel Separation: 100 dB

High channel separation of 100 dB ensures clear and distinct audio signals without interference or crosstalk between channels.

Harmonic Distortion: 0.01%

Low harmonic distortion of 0.01% results in high-quality audio output with minimal distortion or noise, providing a superior listening experience.

Power Supplies (V): 9

Operates at a moderate power supply voltage of 9V, making it suitable for a wide range of audio applications while efficiently managing power consumption.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges from -40 °C to 85°C, ensuring high performance and reliability in harsh environmental conditions.

Technical Specifications

Audio Control ICs TDA7309 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

25.15 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA7309 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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