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LM4838LQ

Texas Instruments

LM4838LQ by Texas Instruments

LM4838LQ by Texas Instruments is a Volume Control Circuit IC with 65 dB Channel Separation and 10% Harmonic Distortion. It is used in audio applications requiring precise volume control, offering a wide operating temperature range from -40 to 85°C. The IC features a compact square package style suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,154 parts In-Stock

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3,154

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Anansix

USA . 2,687 parts In-Stock

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2,687

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Digiode

USA . 2,243 parts In-Stock

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2,243

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 459 parts In-Stock

1+ parts

$1.628

100+ parts

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$2.249

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459

$1.628

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$2.249

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DigiPath Technology Company

USA . 1,884 parts In-Stock

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$1.792

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1,884

$1.792

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ChromeModa Solutions

Germany . 4,216 parts In-Stock

1+ parts

$1.829

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$1.500

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4,216

$1.829

$1.500

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IDEA Electronic Components Group

UK . 1,909 parts In-Stock

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$1.829

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$1.646

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1,909

$1.829

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$1.646

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One Stop Electronics

USA . 638 parts In-Stock

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$7.800

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638

$7.800

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AZTECH Wire

Italy . 808 parts In-Stock

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$14.089

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808

$14.089

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Corphita

USA . 4,999 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,485 parts In-Stock

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Overview

Enhance your audio experience with the LM4838LQ by Texas Instruments, a top-of-the-line Audio Control IC designed for exceptional quality and performance. With Texas Instruments' reputation for excellence in manufacturing, this product guarantees reliability and precision in every application. Whether you're designing a home entertainment system or a professional audio setup, the LM4838LQ delivers unmatched value, benefits, and advantages to ensure an immersive listening experience like never before. Upgrade your audio control circuit with the LM4838LQ and elevate your sound quality to new heights.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto a PCB, saving time and space in the production process.

Package Shape: SQUARE

Square shape offers stability and ease of handling during installation on the circuit board.

General IC Type: VOLUME CONTROL CIRCUIT

Specifically designed for controlling volume, ensuring accurate and precise sound adjustments.

Channel Separation: 65 dB

Provides clear and distinct audio signals for each channel, reducing interference and improving sound quality.

Harmonic Distortion: 10%

Low distortion helps maintain the integrity of the audio signal, resulting in high-quality sound output.

No. of Terminals: 28

Sufficient terminals for connecting to various components in the audio system, allowing for versatility and flexibility in design.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combines multiple package styles to enhance heat dissipation and improve overall performance in a compact form factor.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low-temperature conditions, ensuring consistent performance in various environments.

Terminal Position: QUAD

Quad terminal layout simplifies connection and enhances signal transmission efficiency within the circuit.

Maximum Seated Height: 0.8 mm

Low profile design allows for a compact and space-saving installation on the PCB.

Width: 5 mm

Narrow width enables a smaller footprint on the circuit board, optimizing space usage in the system design.

Minimum Supply Voltage (Vsup): 2.7 V

Works efficiently with low supply voltages, providing energy-efficient operation and compatibility with a wide range of power sources.

Length: 5 mm

Compact length enables a space-saving design and facilitates integration into tight spaces within the system layout.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial conditions, ensuring reliability and durability in demanding environments.

No. of Channels: 2

Dual-channel design allows for stereo sound output, creating a immersive audio experience for the user.

Terminal Form: NO LEAD

Lead-free terminal form conforms to environmental regulations and promotes sustainability in manufacturing.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables precise connections and signal transmission, ensuring high performance and reliability.

Maximum Supply Voltage (Vsup): 5.5 V

Capable of handling higher supply voltages, providing flexibility and compatibility with a wide range of power sources.

Technical Specifications

Audio Control ICs LM4838LQ attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Additional Features:

BRIDGED MODE OPERATION 70 DB CHANNEL SEPARATION ALSO AVAILABLE

Channel Separation:

65 dB

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

S-XQCC-N28

Length:

5 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

LM4838LQ General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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