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TDA7469

STMicroelectronics

TDA7469 by STMicroelectronics

TDA7469 by STMicroelectronics is a BICMOS audio control IC designed for tone control applications. It features 50 dB channel separation, 0.1% harmonic distortion, and operates b/w 1.8V to 5V. Ideal for compact audio systems, it comes in a small outline package with dual channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,247 parts In-Stock

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8,247

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Digiode

USA . 4,679 parts In-Stock

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4,679

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Anansix

USA . 2,179 parts In-Stock

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2,179

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,405 parts In-Stock

1+ parts

$0.167

100+ parts

-

1k+ parts

$0.150

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1,405

$0.167

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$0.150

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MKK Technologies

India . 633 parts In-Stock

1+ parts

$0.313

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633

$0.313

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DigiPath Technology Company

USA . 633 parts In-Stock

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$0.313

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633

$0.313

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Microchip USA

USA . 497 parts In-Stock

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$7.790

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497

$7.790

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AZTECH Wire

Italy . 837 parts In-Stock

1+ parts

$18.950

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837

$18.950

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A-Z Elektronik GmbH

Germany . 6,477 parts In-Stock

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6,477

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Corphita

USA . 4,124 parts In-Stock

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4,124

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Parana Technologies

USA . 1,475 parts In-Stock

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$0.199

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1,475

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$0.199

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Overview

Elevate your audio experience with the TDA7469 from STMicroelectronics, a trusted leader in semiconductor innovation. This advanced audio control IC delivers exceptional sound quality and reliability, perfect for enhancing home entertainment systems or automotive audio applications. With its compact design and superior performance, the TDA7469 ensures seamless integration into any project, making it the ideal choice for engineers seeking both value and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to various environmental factors, making this IC suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for more compact designs and easier assembly in modern electronic products.

Package Shape: RECTANGULAR

The rectangular package shape is optimal for efficient space utilization on PCBs, facilitating easier integration into designs.

General IC Type: TONE CONTROL CIRCUIT

This specific tone control IC type allows for precise audio signal manipulation, enhancing the quality of sound in audio applications.

Channel Separation: 50 dB

A channel separation of 50 dB contributes to improved audio clarity by reducing crosstalk between channels, providing a better listening experience.

Harmonic Distortion: 0.1%

Low harmonic distortion ensures that audio signals are reproduced accurately, maintaining the integrity of the original sound.

Power Supplies (V): 2.4

Operating at a nominal voltage of 2.4V makes this IC versatile for various low-power applications in audio equipment.

No. of Terminals: 24

With 24 terminals, this IC offers flexibility for multiple connections, enabling advanced functionalities in audio control circuits.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

This package style allows for high-density mounting, making it suitable for compact audio devices.

Maximum Operating Temperature: 70 C

A maximum operating temperature of 70 °C ensures reliable performance in a range of environments without overheating.

No. of Bands: 2

Having 2 bands enables effective equalization of audio signals, allowing for tailored sound output to suit various preferences.

Minimum Operating Temperature: 0 C

The 0 °C minimum operating temperature indicates the IC's capability to function in cooler environments without performance loss.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance, enhancing the longevity of the connections.

Terminal Position: DUAL

Dual terminal positions offer flexible design options for PCB layout, enabling easier integration into existing designs.

Maximum Seated Height: 2 mm

A maximum seated height of 2 mm contributes to low-profile design requirements for space-constrained applications.

Width: 5.3 mm

Compact width makes it suitable for integration into small devices where space is at a premium.

Minimum Supply Voltage (Vsup): 1.8 V

The ability to operate at a minimum supply voltage of 1.8V enhances versatility for low-power applications.

Length: 8.2 mm

The small length aids in designing compact system layouts, ensuring efficient use of PCB space.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates reliability for a wide range of everyday applications, making it a versatile choice.

No. of Channels: 2

With 2 channels, this IC is perfect for stereo applications, providing a richer audio experience.

Technology: BICMOS

The BICMOS technology combines the strengths of bipolar and CMOS technologies, resulting in enhanced performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form eases soldering processes, ensuring a secure and reliable connection to the PCB.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density component placement, enabling compact circuit designs.

Maximum Supply Voltage (Vsup): 5 V

Supporting a maximum supply voltage of 5V allows compatibility with many common power supply systems in audio devices.

Technical Specifications

Audio Control ICs TDA7469 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

50 dB

General IC Type:

Harmonic Distortion:

.1 %

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2.4

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

TDA7469 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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