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TDA7052AT/N2,112

NXP Semiconductors

TDA7052AT/N2,112 by NXP Semiconductors

NXP Semiconductors' TDA7052AT/N2,112 is a small outline audio control IC with 8 terminals. It operates b/w -40 to 85 °C and has a low harmonic distortion of 0.3%. Ideal for volume control circuits in industrial applications, it requires a supply voltage of 4.5-18V and consumes up to 12mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 6,426 parts In-Stock

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Digiode

USA . 3,410 parts In-Stock

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Chip Stock

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Anansix

USA . 887 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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ComSIT Distribution GmbH

Germany . 35 parts In-Stock

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ComSIT USA

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Corohmni

South Africa . 121 parts In-Stock

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$1.150

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$1.580

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Aztec Data Supply Inc.

USA . 3,227 parts In-Stock

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$2.730

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One Stop Electronics

USA . 933 parts In-Stock

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$3.800

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Microchip USA

USA . 288 parts In-Stock

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AZTECH Wire

Italy . 461 parts In-Stock

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Semicontronic

India . 1,678 parts In-Stock

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$18.330

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Ampacity Inc.

Singapore . 1,184 parts In-Stock

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UNI Independent Distributors

Spain . 4,504 parts In-Stock

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Continental Prestige Electronics

USA . 2,907 parts In-Stock

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Perfect Parts

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Argo Parts USA

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Corphita

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Bastille Electronics

Australia . 27 parts In-Stock

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Overview

Enhance your audio experience with the TDA7052AT/N2,112 by NXP Semiconductors. Crafted with precision and expertise, this volume control circuit promises top-notch quality and reliability. Ideal for a wide range of applications, this audio control IC ensures crystal-clear sound and minimal distortion at all times. Elevate your audio projects with ease thanks to its user-friendly design and excellent performance. Experience the difference that the TDA7052AT/N2,112 can bring to your audio systems today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is not only lightweight, but also durable and resistant to temperature variations, making the product reliable for long-term use.

Surface Mount: YES

This feature allows for easy and quick installation on circuit boards, reducing assembly time and making the product suitable for automated manufacturing processes.

General IC Type: VOLUME CONTROL CIRCUIT

This specific type of IC is designed to accurately control volume levels, providing precise audio adjustments and enhancing overall sound quality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions, ensuring reliable performance in various applications.

Technology: BIPOLAR

The bipolar technology used in this product offers stable and consistent operation, contributing to the overall reliability and performance of the audio control circuit.

Technical Specifications

Audio Control ICs TDA7052AT/N2,112 attributes and parameters. Explore more Audio Control ICs devices from NXP Semiconductors

Specs

General IC Type:

Harmonic Distortion:

.3 %

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TDA7052AT/N2,112 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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