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TDA7439DS

STMicroelectronics

TDA7439DS by STMicroelectronics

TDA7439DS by STMicroelectronics is a versatile audio control IC designed for tone control applications. It features 100 dB channel separation, 0.01% harmonic distortion, and operates b/w 7-10.2 V. Ideal for high-quality audio systems, it ensures superior sound performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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R&J Components

USA . 6,300 parts In-Stock

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6,300

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Zilex Electronics Inc.

Canada . 4,200 parts In-Stock

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4,200

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Vyrian

USA . 2,080 parts In-Stock

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2,080

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Digiode

USA . 1,217 parts In-Stock

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1,217

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Anansix

USA . 1,076 parts In-Stock

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1,076

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Martec Srl

Italy . 642 parts In-Stock

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642

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Elcom Components

USA . 37 parts In-Stock

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37

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,265 parts In-Stock

1+ parts

$1.111

100+ parts

-

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$1.000

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2,265

$1.111

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$1.000

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MKK Technologies

India . 116 parts In-Stock

1+ parts

$2.090

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116

$2.090

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DigiPath Technology Company

USA . 116 parts In-Stock

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$2.090

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116

$2.090

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AZTECH Wire

Italy . 919 parts In-Stock

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$15.430

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919

$15.430

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Microchip USA

USA . 177 parts In-Stock

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$35.080

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177

$35.080

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A-Z Elektronik GmbH

Germany . 5,253 parts In-Stock

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Kepictronics

USA . 3,257 parts In-Stock

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3,257

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Corphita

USA . 3,100 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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RC Electronics

USA . 1,663 parts In-Stock

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1,663

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Parana Technologies

USA . 289 parts In-Stock

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$1.329

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289

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$1.329

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Overview

Unlock superior sound quality with the TDA7439DS from STMicroelectronics, a leader in innovative audio solutions. This advanced audio control IC ensures pristine clarity and minimal distortion, enhancing your audio applications—be it home theater systems, automotive audio, or portable devices. With its compact design and reliable performance, the TDA7439DS delivers exceptional value, making it an indispensable choice for audio enthusiasts seeking to elevate their listening experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space usage on PCBs, contributing to more streamlined designs.

General IC Type: TONE CONTROL CIRCUIT

Specialized for tone control, this IC is ideal for audio applications, enhancing sound quality and customization.

Channel Separation: 100 dB

High channel separation minimizes crosstalk between channels, ensuring clear and distinct audio channels.

Harmonic Distortion: 0.01%

Very low harmonic distortion promotes high-fidelity audio playback, making this IC suitable for premium audio systems.

Power Supplies (V): 9

Operating at a standard supply voltage makes it versatile and easy to implement in a wide range of applications.

No. of Terminals: 28

A sufficient number of terminals allows for various configurations and features, enhancing the product’s versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in the design of compact electronic devices, popular in modern consumer electronics.

Maximum Operating Temperature: 85 °C

This allows the IC to operate reliably in demanding environments without compromising performance.

No. of Bands: 3

The presence of three bands enables detailed tone control for a rich audio experience.

Minimum Operating Temperature: -10 °C

The wide temperature range ensures functionality in diverse climatic conditions, enhancing the product's reliability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

A premium terminal finish enhances solderability and provides protection against corrosion, boosting longevity.

Terminal Position: DUAL

Dual-position terminals simplify layout design and electronic integration, improving manufacturing efficiency.

Maximum Seated Height: 2.65 mm

A low profile allows for space-saving designs in compact electronic devices without sacrificing performance.

Width: 7.5 mm

Compact width is advantageous for space-constrained applications, promoting efficient PCB design.

Minimum Supply Voltage (Vsup): 7 V

Minimum supply voltage compatibility ensures efficient operation even in low-power environments.

Maximum Time At Peak Reflow Temperature (s): 30

A reasonable peak reflow time accommodates various manufacturing processes, allowing for reliability during assembly.

Peak Reflow Temperature °C: 250

High peak reflow temperature tolerance is advantageous for soldering processes, ensuring robust connections.

Length: 17.9 mm

The length is optimized for various applications, providing a good balance between functionality and compactness.

No. of Channels: 2

Having two channels supports stereo audio applications, enriching the user experience in audio systems.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminals ease assembly and soldering, improving production efficiency and ensuring reliable connections.

Maximum Supply Current: 10 mA

Low maximum supply current facilitates energy-efficient designs, which is critical in battery-operated devices.

Terminal Pitch: 1.27 mm

A standard terminal pitch fosters compatibility with existing layout designs, promoting ease of integration.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level indicates the IC's reliability in various environments, providing stability in humid conditions.

Maximum Supply Voltage (Vsup): 10.2 V

The maximum supply voltage allows for flexibility in circuit design, accommodating various system requirements.

Technical Specifications

Audio Control ICs TDA7439DS attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TDA7439DS General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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