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TDA7468D

STMicroelectronics

TDA7468D by STMicroelectronics

TDA7468D by STMicroelectronics is a dual-channel tone control IC designed for audio applications. It features 90 dB channel separation, 0.01% harmonic distortion, and operates b/w 5-10 V. Ideal for enhancing sound quality in consumer electronics, it comes in a compact SO package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,319 parts In-Stock

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6,319

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Chip Stock

USA . 5,100 parts In-Stock

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5,100

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Anansix

USA . 1,497 parts In-Stock

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1,497

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Digiode

USA . 621 parts In-Stock

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621

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ComSIT Distribution GmbH

Germany . 224 parts In-Stock

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224

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,088 parts In-Stock

1+ parts

$0.949

100+ parts

-

1k+ parts

$0.854

10k+ parts

-

1,088

$0.949

-

$0.854

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MKK Technologies

India . 968 parts In-Stock

1+ parts

$1.784

100+ parts

-

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968

$1.784

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DigiPath Technology Company

USA . 968 parts In-Stock

1+ parts

$1.784

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-

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968

$1.784

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Microchip USA

USA . 177 parts In-Stock

1+ parts

$3.608

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177

$3.608

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AZTECH Wire

Italy . 1,059 parts In-Stock

1+ parts

$14.850

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1,059

$14.850

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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RC Electronics

USA . 6,000 parts In-Stock

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6,000

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A-Z Elektronik GmbH

Germany . 4,986 parts In-Stock

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4,986

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Parana Technologies

USA . 1,854 parts In-Stock

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$1.134

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1,854

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$1.134

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Corphita

USA . 642 parts In-Stock

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642

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Kepictronics

USA . 263 parts In-Stock

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263

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Overview

Elevate your audio experience with the TDA7468D from STMicroelectronics, a leader in innovation and quality. This cutting-edge audio control IC is designed for superior tone management, ensuring crystal-clear sound in various applications—from home audio systems to automotive entertainment. With exceptional channel separation and low distortion, you'll enjoy rich acoustics that bring music to life. Choose TDA7468D for reliability, performance, and an auditory delight that resonates!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a durable and cost-effective solution, ensuring reliability in various applications.

Surface Mount: YES

Being surface mount compatible allows for easier PCB design and integration, making it suitable for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on the PCB, facilitating compact design.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, it enhances audio quality by allowing for adjustable bass and treble, improving overall sound experience.

Channel Separation: 90 dB

High channel separation minimizes crosstalk between channels, ensuring a clean and clear audio output.

Harmonic Distortion: 0.01%

Low harmonic distortion indicates high fidelity in sound reproduction, making it ideal for audiophile applications.

Power Supplies (V): 9

Supports a standard 9V supply, making it versatile and easy to integrate into a wide range of systems.

No. of Terminals: 28

A higher number of terminals can provide more features and connections, enhancing functionality and flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact design, suitable for space-constrained applications.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C ensures reliability in typical consumer electronics without overheating issues.

No. of Bands: 2

With two bands for tone control (bass and treble), users can personalize their audio experience.

Minimum Operating Temperature: 0 °C

The minimum operating temperature allows the IC to function in a wide range of environments, including cooler climates.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold plating ensures excellent conductivity and corrosion resistance, enhancing durability.

Terminal Position: DUAL

Dual terminal position provides flexible layout options on PCBs, improving design versatility.

Maximum Seated Height: 2.65 mm

Low seated height allows the IC to fit into low-profile designs, ensuring compatibility with compact devices.

Width: 7.5 mm

A compact width makes it suitable for integration into narrow PCBs, ideal for portable and space-saving designs.

Minimum Supply Voltage (Vsup): 5 V

The ability to operate at a minimum of 5V makes this IC suitable for low-voltage applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds supports effective soldering while preventing damage to the IC during assembly.

Peak Reflow Temperature °C: 250

The IC can withstand high peak temperatures during the manufacturing process, ensuring robustness.

Length: 17.9 mm

The length is optimized for performance while ensuring compatibility with standard PCB layouts.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures performance in standard operating conditions commonly found in consumer products.

No. of Channels: 2

Having two channels allows for stereo operation, meeting the demands of modern audio applications.

Technology: BICMOS

BICMOS technology combines both CMOS and bipolar processes, resulting in high performance with low power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and enhance physical robustness on the PCB.

Terminal Pitch: 1.27 mm

A standard terminal pitch ensures compatibility with most PCB designs and promotes easier assembly.

Moisture Sensitivity Level (MSL): 3

MSL 3 provides guidelines for handling and storage, mitigating issues related to moisture exposure in manufacturing.

Maximum Supply Voltage (Vsup): 10 V

The upper limit of 10V allows the IC to be used in equipment needing higher power, boosting design flexibility.

Technical Specifications

Audio Control ICs TDA7468D attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TDA7468D General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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