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LC75348

Onsemi

LC75348 by Onsemi

Onsemi LC75348 is a 30-terminal Audio Control IC in PLASTIC/EPOXY package. Operates at -30 to 70 °C with 9V power supply. Ideal for audio applications requiring CMOS technology and IN-LINE, SHRINK PITCH style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,828 parts In-Stock

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Digiode

USA . 720 parts In-Stock

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720

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 6,788 parts In-Stock

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6,788

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Kulean Microsystems

USA . 3,026 parts In-Stock

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3,026

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Problanco Electronics

Mexico . 2,668 parts In-Stock

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Corphita

USA . 2,173 parts In-Stock

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TANS Electronics

Latvia . 2,111 parts In-Stock

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Corohmni

South Africa . 72 parts In-Stock

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UHIMA Technologies

Türkiye . 31 parts In-Stock

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Overview

Unleash the power of audio control with the LC75348 by Onsemi. Crafted with precision and expertise, this innovative product offers unparalleled quality and reliability. Designed for a wide range of applications, this Audio Control IC promises seamless integration and superior performance. Elevate your audio experience with the LC75348's advanced technology and convenient features. Trust in Onsemi's reputation for excellence and choose the LC75348 for unrivaled value and benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring a longer lifespan and resistance to external factors.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs and PCB layouts, saving space and making installation simpler.

Power Supplies (V): 9

Operating at 9V allows for compatibility with a wide range of systems and power sources, making it versatile for various applications.

No. of Terminals: 30

Having 30 terminals enables connectivity with multiple components and devices, increasing the functionality and flexibility of the IC.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line package style with shrink pitch design enhances the IC's thermal performance and provides efficient heat dissipation.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the IC can function reliably under standard operating conditions without overheating.

Minimum Operating Temperature: -30 °C

Being able to operate at temperatures as low as -30 °C ensures the IC can withstand cold environments and maintain performance.

Terminal Position: DUAL

Dual terminal positions offer redundancy and backup connections, reducing the risk of signal loss or failure due to a single point of contact.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption, high noise immunity, and fast switching speeds, enhancing overall performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and solder joints, increasing reliability in demanding applications and environments.

Terminal Pitch: 1.78 mm

A terminal pitch of 1.78mm offers adequate spacing for easy soldering and assembly, ensuring precise connections and reducing the risk of short circuits.

Technical Specifications

Audio Control ICs LC75348 attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T30

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP30,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LC75348 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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