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PGA2310PA

Texas Instruments

PGA2310PA by Texas Instruments

PGA2310PA by Texas Instruments is a Volume Control Circuit IC with 2 channels and 126 dB channel separation. Operating at -40 to 85 °C, it requires +5V and ±15V power supplies. Ideal for audio applications, this BICMOS technology IC has 16 terminals in an in-line package style.

Median Price

$23.355

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 58 parts In-Stock

1+ parts

$19.640

100+ parts

$30.662

1k+ parts

-

10k+ parts

-

58

$19.640

$30.662

-

-

Mouser Electronics

USA . 54 parts In-Stock

1+ parts

$33.580

100+ parts

$23.910

1k+ parts

$23.080

10k+ parts

-

54

$33.580

$23.910

$23.080

-

Rochester

USA . 4,940 parts In-Stock

1+ parts

-

100+ parts

$20.760

1k+ parts

$18.570

10k+ parts

$17.480

4,940

-

$20.760

$18.570

$17.480

DigiKey

USA . 4,940 parts In-Stock

1+ parts

-

100+ parts

$27.310

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-

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4,940

-

$27.310

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Verical

USA . 4,595 parts In-Stock

1+ parts

-

100+ parts

$25.950

1k+ parts

$23.212

10k+ parts

$21.850

4,595

-

$25.950

$23.212

$21.850

Arrow

USA . 75 parts In-Stock

1+ parts

-

100+ parts

$16.770

1k+ parts

-

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75

-

$16.770

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,052 parts In-Stock

1+ parts

$16.770

100+ parts

-

1k+ parts

-

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3,052

$16.770

-

-

-

Digiode

USA . 1,737 parts In-Stock

1+ parts

$18.658

100+ parts

-

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1,737

$18.658

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DigiKey Marketplace

USA . 4,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,940

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-

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Chip Stock

USA . 910 parts In-Stock

1+ parts

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910

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Electronic Expediters

USA . 1 parts In-Stock

1+ parts

-

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-

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1

-

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 5 parts In-Stock

1+ parts

$1.810

100+ parts

-

1k+ parts

$2.365

10k+ parts

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5

$1.810

-

$2.365

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DigiPath Technology Company

USA . 2,250 parts In-Stock

1+ parts

$1.993

100+ parts

$1.834

1k+ parts

-

10k+ parts

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2,250

$1.993

$1.834

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ChromeModa Solutions

Germany . 1,198 parts In-Stock

1+ parts

$2.034

100+ parts

$1.668

1k+ parts

-

10k+ parts

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1,198

$2.034

$1.668

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IDEA Electronic Components Group

UK . 735 parts In-Stock

1+ parts

$2.034

100+ parts

-

1k+ parts

$1.831

10k+ parts

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735

$2.034

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$1.831

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Ampacity Inc.

Singapore . 1,904 parts In-Stock

1+ parts

$14.250

100+ parts

-

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1,904

$14.250

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Corphita

USA . 1,718 parts In-Stock

1+ parts

$17.676

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1,718

$17.676

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Microchip USA

USA . 2,040 parts In-Stock

1+ parts

$50.790

100+ parts

$50.070

1k+ parts

$49.700

10k+ parts

$49.340

2,040

$50.790

$50.070

$49.700

$49.340

Lixinc

USA . 16,427 parts In-Stock

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16,427

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Kepictronics

USA . 10,000 parts In-Stock

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10,000

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A-Z Elektronik GmbH

Germany . 6,531 parts In-Stock

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6,531

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Allen Electronics Distributors

USA . 63 parts In-Stock

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63

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Overview

Elevate your audio experience with the PGA2310PA by Texas Instruments. Crafted with precision and expertise, this Audio Control IC boasts exceptional channel separation of 126 dB and a wide operating temperature range. Perfect for volume control circuits, this versatile IC offers unrivaled performance and reliability. Whether you're designing professional audio equipment or high-fidelity systems, the PGA2310PA delivers superior sound quality and seamless integration. Trust in Texas Instruments to bring innovation and excellence to your projects, setting new standards in audio control technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design, making it suitable for various applications.

Channel Separation: 126 dB

High channel separation of 126 dB ensures clear and distinct audio signals for enhanced sound quality.

Power Supplies (V): 5,+/-15

Wide range of power supply options from 5V to +/-15V allows flexibility in system integration and power source selection.

No. of Terminals: 16

With 16 terminals, this IC offers multiple connectivity options and room for expansion in audio control circuits.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures functionality even in extreme cold conditions.

Technology: BICMOS

The BICMOS technology used in this IC provides a balance of high-speed performance and low power consumption.

Maximum Supply Voltage (Vsup): 15.5 V

The high maximum supply voltage of 15.5V allows for robust power supply capabilities, suitable for demanding applications.

Technical Specifications

Audio Control ICs PGA2310PA attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 4.5V TO 5.5V SUPPLY

Channel Separation:

126 dB

General IC Type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

No. of Bands:

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,+-15

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

21.5 mA

Maximum Supply Voltage (Vsup):

15.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

PGA2310PA General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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