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TAS3001CPWG4

Texas Instruments

TAS3001CPWG4 by Texas Instruments

TAS3001CPWG4 by Texas Instruments is an Audio Control IC with 2 channels, operating at 3.3V. It features a tone control circuit in a small outline package suitable for commercial temperature grades. The IC has 28 terminals, Gull Wing form, and is ideal for audio applications requiring precise sound adjustments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,175 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,175

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Digiode

USA . 2,812 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,812

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,043 parts In-Stock

1+ parts

$0.552

100+ parts

-

1k+ parts

$1.654

10k+ parts

-

2,043

$0.552

-

$1.654

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ChromeModa Solutions

Germany . 3,956 parts In-Stock

1+ parts

$0.620

100+ parts

$0.508

1k+ parts

-

10k+ parts

-

3,956

$0.620

$0.508

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IDEA Electronic Components Group

UK . 1,763 parts In-Stock

1+ parts

$0.620

100+ parts

-

1k+ parts

$0.558

10k+ parts

-

1,763

$0.620

-

$0.558

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AZTECH Wire

Italy . 495 parts In-Stock

1+ parts

$7.033

100+ parts

-

1k+ parts

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10k+ parts

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495

$7.033

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One Stop Electronics

USA . 855 parts In-Stock

1+ parts

$17.800

100+ parts

-

1k+ parts

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10k+ parts

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855

$17.800

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Corphita

USA . 1,925 parts In-Stock

1+ parts

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1,925

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DigiPath Technology Company

USA . 704 parts In-Stock

1+ parts

-

100+ parts

$0.559

1k+ parts

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10k+ parts

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704

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$0.559

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Microchip USA

USA . 432 parts In-Stock

1+ parts

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432

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Overview

Elevate your audio experience with the TAS3001CPWG4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in their products. The TAS3001CPWG4 falls under the category of Audio Control ICs, offering unparalleled tone control capabilities for your audio devices. With a sleek rectangular package design and surface mount technology, this IC is perfect for a wide range of applications. Whether you're a music enthusiast or a tech-savvy professional, this product offers value, benefits, and advantages that will take your audio projects to the next level. Experience the difference with the TAS3001CPWG4 from Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection to the IC, making it suitable for various applications and environments.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

Rectangular shape provides a standard form factor that is widely supported and easy to integrate into existing designs.

General IC Type: TONE CONTROL CIRCUIT

Tone control circuit IC type allows for precise adjustment of audio frequencies, providing high-quality sound output.

Power Supplies (V): 3.3

Operates on a standard power supply voltage of 3.3V, making it compatible with a wide range of systems and devices.

No. of Terminals: 28

Plenty of terminals available for connecting various components and peripherals, offering flexibility in circuit design.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline and thin profile design with shrink pitch layout saves space on the PCB and enables compact device designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand high temperature environments and prolonged use.

No. of Bands: 2

Two bands allow for more versatile tone control options and customization of audio output.

Minimum Operating Temperature: 0 °C

Can operate in temperatures as low as 0°C, making it suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures reliable electrical connections and corrosion resistance for long-term performance.

Terminal Position: DUAL

Dual terminal position provides redundancy and backup connections, enhancing overall reliability of the IC.

Maximum Seated Height: 1.2 mm

Low seated height enables compact and slim device designs, ideal for space-constrained applications.

Width: 4.4 mm

Narrow width allows for efficient use of PCB real estate and enables close placement of components for optimized circuit layout.

Minimum Supply Voltage (Vsup): 3 V

Can operate with a minimum supply voltage of 3V, ensuring compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, making it suitable for soldering processes and assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and robust mechanical connections during assembly.

Length: 9.7 mm

Compact length makes it easy to integrate this IC into various electronic devices and applications without taking up excessive space.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance within standard temperature ranges commonly encountered in commercial applications.

No. of Channels: 2

Two channels provide stereo audio capabilities, allowing for independent control and processing of audio signals for enhanced sound quality.

Terminal Form: GULL WING

Gull wing terminal form offers sturdy mechanical support and facilitates easy soldering during the assembly process.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65mm allows for close spacing of terminals, contributing to compact design and efficient use of PCB space.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this IC can handle higher voltage inputs while remaining within safe operating limits.

Technical Specifications

Audio Control ICs TAS3001CPWG4 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TAS3001CPWG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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