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TDA7429T13TR

STMicroelectronics

TDA7429T13TR by STMicroelectronics

TDA7429T13TR by STMicroelectronics is a high-performance audio control IC designed for tone control applications. It features 90 dB channel separation, 0.01% harmonic distortion, and operates within a supply voltage range of 7-10.2 V. Ideal for compact audio systems, it comes in a low-profile flatpack package with 44 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,606 parts In-Stock

1+ parts

-

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4,606

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Anansix

USA . 2,082 parts In-Stock

1+ parts

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1k+ parts

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2,082

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Digiode

USA . 196 parts In-Stock

1+ parts

-

100+ parts

-

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196

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,263 parts In-Stock

1+ parts

$2.626

100+ parts

-

1k+ parts

$2.363

10k+ parts

-

1,263

$2.626

-

$2.363

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MKK Technologies

India . 177 parts In-Stock

1+ parts

$4.937

100+ parts

-

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177

$4.937

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DigiPath Technology Company

USA . 177 parts In-Stock

1+ parts

$4.937

100+ parts

-

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177

$4.937

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Corphita

USA . 3,320 parts In-Stock

1+ parts

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3,320

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Parana Technologies

USA . 610 parts In-Stock

1+ parts

-

100+ parts

$3.139

1k+ parts

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610

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$3.139

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Overview

Elevate your audio experience with the TDA7429T13TR from STMicroelectronics, a leading name in innovation and reliability. This premium audio control IC delivers exceptional sound quality with minimal distortion, ensuring crystal-clear performance for any application, from home theaters to automotive systems. With its compact design and robust features, it empowers engineers to create superior audio solutions that captivate users and enhance their listening pleasure. Experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material enhances reliability and simplifies integration into various applications.

Surface Mount: YES

Facilitates compact design and high-density circuit layouts, ideal for modern electronics.

Package Shape: SQUARE

Optimizes PCB layout and spacing, making it easier to fit into tight spaces.

General IC Type: TONE CONTROL CIRCUIT

Provides sophisticated audio control capabilities, ideal for enhancing sound quality in audio applications.

Channel Separation: 90 dB

Ensures clear audio separation between channels, resulting in a more immersive listening experience.

Harmonic Distortion: 0.01%

Maintains excellent audio fidelity with minimal distortion, ensuring high-quality sound reproduction.

Power Supplies (V): 9

Standard supply voltage simplifies design and integration with common power sources.

No. of Terminals: 44

Provides ample connectivity options, allowing for versatile designs and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile design minimizes height in PCB assemblies, suitable for space-constrained applications.

Maximum Operating Temperature: 70 °C

Suitable for a wide range of environments, ensuring reliable performance under varying conditions.

No. of Bands: 3

Allows for more precise tuning of audio frequencies, enabling personalized sound tailoring.

Minimum Operating Temperature: 0 °C

Ensures functionality in low-temperature environments, broadening application potential.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and oxidation resistance, ensuring reliable long-term performance.

Terminal Position: QUAD

Facilitates easy PCB layout and simplifies routing for complex audio systems.

Maximum Seated Height: 1.6 mm

Compact height allows for integration into slim device designs without compromising performance.

Width: 10 mm

Compact width makes it easy to fit into various PCB layouts while optimizing real estate.

Minimum Supply Voltage (Vsup): 7 V

Flexible power supply requirements enhance compatibility with various circuits and systems.

Length: 10 mm

Easy to integrate into a variety of designs, promoting versatility and ease of use.

Temperature Grade: COMMERCIAL

Suitable for a wide array of commercial applications, offering reliability and performance.

No. of Channels: 2

Ideal for stereo audio applications, allowing for enhanced sound experience for users.

Technology: BICMOS

Combines the advantages of Bipolar and CMOS technologies, resulting in high performance and low power consumption.

Terminal Form: GULL WING

Enhances soldering reliability and ease of mounting on PCBs, ensuring robust connections.

Terminal Pitch: 0.8 mm

Allows for denser terminal arrangements, which is beneficial for compact and complex circuit designs.

Maximum Supply Voltage (Vsup): 10.2 V

Expands application range with high voltage tolerance, making it versatile for various audio applications.

Technical Specifications

Audio Control ICs TDA7429T13TR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7429T13TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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