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TDA7340G013TR

STMicroelectronics

TDA7340G013TR by STMicroelectronics

TDA7340G013TR by STMicroelectronics is a BICMOS audio control IC designed for tone control applications. It features 100 dB channel separation, 0.02% harmonic distortion, and operates b/w -40 °C to 85 °C. Ideal for industrial audio systems, it comes in a compact flatpack package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,984 parts In-Stock

1+ parts

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2,984

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Anansix

USA . 2,686 parts In-Stock

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2,686

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Digiode

USA . 1,247 parts In-Stock

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1,247

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 677 parts In-Stock

1+ parts

$0.491

100+ parts

-

1k+ parts

$0.442

10k+ parts

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677

$0.491

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$0.442

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MKK Technologies

India . 1,937 parts In-Stock

1+ parts

$0.924

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1,937

$0.924

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DigiPath Technology Company

USA . 1,937 parts In-Stock

1+ parts

$0.924

100+ parts

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1,937

$0.924

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Corphita

USA . 3,871 parts In-Stock

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3,871

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Parana Technologies

USA . 590 parts In-Stock

1+ parts

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100+ parts

$0.587

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590

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$0.587

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Overview

Elevate your audio experience with the TDA7340G013TR from STMicroelectronics—an industry leader known for excellence. This innovative audio control IC ensures crystal-clear sound with exceptional tone control and minimal distortion. Ideal for a variety of applications, it seamlessly integrates into your designs, offering reliability even in demanding environments. Choose the TDA7340G013TR to unlock superior audio quality and enhance your products with cutting-edge technology you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durable protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology enables high-density assembly and lower production costs, facilitating easier integration into compact designs.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and enables better layout versatility.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, this IC is essential for audio applications, providing enhanced sound quality and user customization.

Channel Separation: 100 dB

High channel separation minimizes crosstalk, ensuring clear and distinct audio channels for an immersive listener experience.

Harmonic Distortion: 0.02 %

Low harmonic distortion indicates high fidelity audio performance, making it ideal for high-quality audio applications.

No. of Terminals: 44

A higher number of terminals allows for more flexible connections and features, enhancing overall functionality.

Package Style (Meter): FLATPACK

Flatpack style is advantageous for automated assembly processes, improving throughput in production.

Maximum Operating Temperature: 85 °C

This high maximum operating temperature allows the IC to operate reliably in demanding environmental conditions.

No. of Bands: 2

With two bands, the IC provides enough control for basic tone adjustment, making it suitable for a variety of audio applications.

Minimum Operating Temperature: -40 °C

The wide temperature range makes this IC suitable for industrial and outdoor applications where extreme temperatures can occur.

Terminal Position: QUAD

Quad terminal positioning facilitates easier PCB layout and soldering, enhancing circuit board design efficiency.

Maximum Seated Height: 2.45 mm

A low seated height helps in creating compact devices with a smaller profile, appealing for modern design requirements.

Width: 10 mm

A compact width allows for space-efficient designs, contributing to the miniaturization of audio control units.

Minimum Supply Voltage (Vsup): 6 V

A low minimum supply voltage broadens compatibility with various power supplies and battery-operated devices.

Length: 10 mm

Like the width, the 10 mm length ensures that this component fits well into compact spaces, ideal for portable devices.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this IC can withstand harsh conditions while maintaining reliable performance.

No. of Channels: 2

With two channels, it supports stereo audio applications, providing a richer sound experience.

Technology: BICMOS

BICMOS technology combines high-speed performance with low power consumption, making this IC ideal for efficient audio processing.

Terminal Form: GULL WING

Gull wing terminals offer excellent solder joint strength and ease of assembly, ensuring robust connections.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch optimizes board space usage while facilitating modern design standards.

Maximum Supply Voltage (Vsup): 10 V

A maximum supply voltage of 10 V allows compatibility with a variety of power sources, enhancing versatility in design applications.

Technical Specifications

Audio Control ICs TDA7340G013TR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.02 %

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7340G013TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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