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PGA4311UA1

Texas Instruments

PGA4311UA1 by Texas Instruments

PGA4311UA1 by Texas Instruments is a 4-channel volume control circuit in a small outline package. It operates b/w -40 to 85°C with +-5V power supplies. Ideal for audio applications requiring precise volume control in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,434 parts In-Stock

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5,434

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Digiode

USA . 3,893 parts In-Stock

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3,893

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 321 parts In-Stock

1+ parts

$0.156

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321

$0.156

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Parana Technologies

USA . 559 parts In-Stock

1+ parts

$0.671

100+ parts

-

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$1.720

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559

$0.671

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$1.720

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ChromeModa Solutions

Germany . 3,276 parts In-Stock

1+ parts

$0.754

100+ parts

$0.618

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3,276

$0.754

$0.618

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IDEA Electronic Components Group

UK . 422 parts In-Stock

1+ parts

$0.754

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$0.679

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422

$0.754

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$0.679

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Semicontronic

India . 1,361 parts In-Stock

1+ parts

$7.800

100+ parts

$7.605

1k+ parts

$7.566

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1,361

$7.800

$7.605

$7.566

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AZTECH Wire

Italy . 824 parts In-Stock

1+ parts

$12.492

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824

$12.492

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Ampacity Inc.

Singapore . 327 parts In-Stock

1+ parts

$13.800

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327

$13.800

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One Stop Electronics

USA . 224 parts In-Stock

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$16.800

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224

$16.800

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Argo Parts USA

USA . 4,947 parts In-Stock

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Corphita

USA . 4,467 parts In-Stock

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Continental Prestige Electronics

USA . 3,582 parts In-Stock

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3,582

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DigiPath Technology Company

USA . 1,249 parts In-Stock

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$0.680

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1,249

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$0.680

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Advanced Electronics

New Zealand . 95 parts In-Stock

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95

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Bastille Electronics

Australia . 59 parts In-Stock

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59

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Overview

Enhance your audio control experience with the PGA4311UA1 by Texas Instruments. Manufactured with top-notch quality and expertise, this volume control circuit offers unparalleled precision and reliability for a wide range of applications in the audio industry. With its compact design and advanced technology, this product provides customers with exceptional value, superior performance, and seamless integration. Elevate your audio systems to new heights with the PGA4311UA1 and enjoy the benefits of precise volume control like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy installation on a circuit board, saving space and simplifying the manufacturing process.

No. of Channels: 4

Offers multiple audio channels for more complex sound systems, allowing for greater versatility in audio control.

Power Supplies (V): +-5

Supports a wide range of power supplies, making it compatible with a variety of audio systems and setups.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without compromising performance, ideal for industrial applications.

Minimum Operating Temperature: -40 °C

Can function in extremely low temperatures, making it suitable for a range of operating conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high reliability, prolonging the lifespan of the IC.

Technical Specifications

Audio Control ICs PGA4311UA1 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

17.905 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

PGA4311UA1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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