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LM4835LQ

Texas Instruments

LM4835LQ by Texas Instruments

Texas Instruments' LM4835LQ is a 2-channel volume control circuit with 65 dB channel separation and 10% harmonic distortion. This audio control IC, in a square chip carrier package, operates b/w -40 to 85°C and suits industrial applications requiring precise volume adjustment in compact setups.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,558 parts In-Stock

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Anansix

USA . 1,888 parts In-Stock

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Digiode

USA . 1,489 parts In-Stock

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1,489

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Distributors (Availability)

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Parana Technologies

USA . 1,373 parts In-Stock

1+ parts

$2.393

100+ parts

$222.246

1k+ parts

$2.154

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1,373

$2.393

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DigiPath Technology Company

USA . 503 parts In-Stock

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$2.635

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503

$2.635

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ChromeModa Solutions

Germany . 4,552 parts In-Stock

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$2.689

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$2.205

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IDEA Electronic Components Group

UK . 536 parts In-Stock

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$2.689

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$2.420

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536

$2.689

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$2.420

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AZTECH Wire

Italy . 774 parts In-Stock

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$11.306

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One Stop Electronics

USA . 680 parts In-Stock

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$11.800

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Corphita

USA . 682 parts In-Stock

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Kepictronics

USA . 450 parts In-Stock

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Overview

Elevate your audio experience with the LM4835LQ by Texas Instruments, a cutting-edge Audio Control IC designed to provide unmatched quality and performance. With a focus on innovation and reliability, Texas Instruments ensures that every product meets the highest standards in the industry. Ideal for a wide range of applications, this Volume Control Circuit offers exceptional channel separation and low harmonic distortion, making it perfect for amplifying sound in industrial settings. Take your sound system to the next level with the LM4835LQ and enjoy crystal-clear audio like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto circuit boards, making installation and assembly quicker and more convenient.

Package Shape: SQUARE

Square package shape provides a compact and space-saving design, allowing for easier integration into compact electronic devices.

Channel Separation: 65 dB

High channel separation of 65 dB ensures clear and distinct sound quality, making it ideal for audio applications requiring precise channel separation.

Harmonic Distortion: 10%

Low harmonic distortion of 10% ensures that the audio output is clean and accurate without unwanted distortion, providing high-quality sound for the user.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options, enabling the IC to be used in a wide range of audio control applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination ensures efficient heat dissipation and a thin profile, making it suitable for applications where space and heat management are critical.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows the IC to operate reliably in various environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures the IC can function even in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection, reducing the risk of signal loss or disconnection in the audio control circuit.

Maximum Seated Height: 0.8 mm

Low maximum seated height of 0.8 mm allows for a compact design and easy integration into slim electronic devices without adding significant height.

Width: 5 mm

Compact width of 5 mm enables the IC to fit into tight spaces without compromising on functionality, making it versatile for various audio control applications.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage of 2.7 V ensures efficient power consumption and compatibility with a wide range of power sources, making the IC energy-efficient.

Length: 5 mm

Compact length of 5 mm allows the IC to be easily integrated into small form factor devices without taking up excessive space, ideal for compact electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can operate reliably in harsh industrial environments with varying temperature ranges, providing consistent performance under tough conditions.

No. of Channels: 2

Having 2 channels allows the IC to control and manage audio signals effectively for stereo sound output, making it suitable for applications requiring dual-channel audio control.

Terminal Form: NO LEAD

No lead terminal form simplifies the installation process and minimizes the risk of soldering errors, ensuring a secure and reliable connection in the audio control circuit.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5 mm enables precise and compact PCB layout design, allowing for efficient connectivity and space-saving integration of the IC in audio control circuits.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage of 5.5 V ensures compatibility with various power sources and allows the IC to support different audio equipment that requires higher voltage levels.

Technical Specifications

Audio Control ICs LM4835LQ attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Additional Features:

BRIDGED MODE OPERATION 70 DB CHANNEL SEPARATION ALSO AVAILABLE

Channel Separation:

65 dB

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

S-XQCC-N28

Length:

5 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

LM4835LQ General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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