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LM4811YD/NOPB

Texas Instruments

LM4811YD/NOPB by Texas Instruments

LM4811YD/NOPB by Texas Instruments is a Volume Control Circuit with 2 functions, operating at temperatures from -40 to 85°C. It has a supply voltage of 2.6/5V and consumes a max current of 3mA. This Audio Control IC in small outline package is ideal for industrial applications requiring precise volume control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,750 parts In-Stock

1+ parts

-

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5,750

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Digiode

USA . 4,639 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,639

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,022 parts In-Stock

1+ parts

$2.006

100+ parts

-

1k+ parts

$2.531

10k+ parts

-

1,022

$2.006

-

$2.531

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DigiPath Technology Company

USA . 266 parts In-Stock

1+ parts

$2.209

100+ parts

$2.032

1k+ parts

-

10k+ parts

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266

$2.209

$2.032

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ChromeModa Solutions

Germany . 4,867 parts In-Stock

1+ parts

$2.254

100+ parts

$1.848

1k+ parts

-

10k+ parts

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4,867

$2.254

$1.848

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IDEA Electronic Components Group

UK . 30 parts In-Stock

1+ parts

$2.254

100+ parts

-

1k+ parts

$2.029

10k+ parts

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30

$2.254

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$2.029

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AZTECH Wire

Italy . 502 parts In-Stock

1+ parts

$13.280

100+ parts

-

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502

$13.280

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One Stop Electronics

USA . 231 parts In-Stock

1+ parts

$16.800

100+ parts

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231

$16.800

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Corphita

USA . 3,658 parts In-Stock

1+ parts

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3,658

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Microchip USA

USA . 199 parts In-Stock

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199

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Overview

Enhance your audio control experience with the LM4811YD/NOPB by Texas Instruments. This high-quality audio control IC offers unparalleled performance and reliability, making it a top choice for various applications in the audio industry. With its compact design and advanced features, this product delivers exceptional value and benefits to customers, ensuring an enhanced audio experience like never before. Upgrade your audio systems with the LM4811YD/NOPB and enjoy superior sound quality and control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resilience to the package, ensuring the IC remains protected in various environments.

Surface Mount: YES

Being surface mount allows for easier and more convenient assembly on circuit boards, saving time and effort during production.

No. of Functions: 2

With 2 functions in one IC, this product offers versatility and functionality in a compact package, making it a cost-effective solution.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the circuit board, optimizing the layout and integration of the IC.

General IC Type: VOLUME CONTROL CIRCUIT

As a volume control circuit, this IC provides precise and reliable control over audio volume levels, ensuring high-quality sound output.

Power Supplies (V): 2.6/5

Supporting multiple power supply voltages, this IC can be used in a variety of applications, offering flexibility in design and implementation.

No. of Terminals: 10

Having 10 terminals allows for connection to various components within the circuit, enabling seamless integration and communication among different parts.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact designs and applications where size is a constraint.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand elevated temperatures without compromising performance, ensuring reliability in harsh conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without impacting functionality, making it suitable for a wide range of applications.

Terminal Position: DUAL

The dual terminal position provides flexibility in connection options, accommodating different circuit layouts and configurations for enhanced versatility.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this IC can endure reflow soldering processes without damage, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

Supporting a peak reflow temperature of 260°C, this IC is compatible with standard reflow soldering techniques commonly used in manufacturing.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC meets stringent temperature requirements and operational standards, making it suitable for robust and demanding environments.

Terminal Form: NO LEAD

The no lead terminal form simplifies assembly and improves reliability by eliminating the risk of solder cracks or joint failures, enhancing overall product longevity.

Maximum Supply Current: 3 mA

With a maximum supply current of 3 mA, this IC has low power consumption, minimizing energy usage and reducing heat generation, which is beneficial for efficiency and reliability.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for close spacing between terminals, promoting compact design integration and enabling high-density circuit layouts.

Technical Specifications

Audio Control ICs LM4811YD/NOPB attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-N10

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC10,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.6/5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LM4811YD/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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