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TDA7466

STMicroelectronics

TDA7466 by STMicroelectronics

TDA7466 by STMicroelectronics is a BICMOS audio control IC designed for tone control applications. It features 90 dB channel separation, 0.01% harmonic distortion, and operates b/w 7-10.2 V. Ideal for enhancing audio quality in consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,462 parts In-Stock

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7,462

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Anansix

USA . 2,566 parts In-Stock

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2,566

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Digiode

USA . 1,567 parts In-Stock

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1,567

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Bristol Electronics

USA . 4 parts In-Stock

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Atlantic Semiconductor

USA . 4 parts In-Stock

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4

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 310 parts In-Stock

1+ parts

$1.352

100+ parts

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$1.217

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310

$1.352

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$1.217

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MKK Technologies

India . 1,260 parts In-Stock

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$2.543

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$2.543

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DigiPath Technology Company

USA . 1,260 parts In-Stock

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$2.543

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1,260

$2.543

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Microchip USA

USA . 639 parts In-Stock

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$6.873

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639

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AZTECH Wire

Italy . 1,195 parts In-Stock

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$17.270

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$17.270

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Corphita

USA . 3,901 parts In-Stock

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Parana Technologies

USA . 1,594 parts In-Stock

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$1.617

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1,594

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$1.617

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Overview

Elevate your audio experience with the TDA7466 by STMicroelectronics, a premier tone control IC that embodies superior quality and reliability. Renowned for innovation, STMicroelectronics ensures exceptional performance, delivering crystal-clear sound with remarkable channel separation and minimal distortion. Ideal for audio applications ranging from home entertainment systems to automotive sound solutions, this cutting-edge component offers unparalleled value, enhancing user enjoyment while simplifying design integration.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on printed circuit boards, facilitating easier integration into designs.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, this IC enhances audio quality by providing users with the ability to adjust bass, midrange, and treble frequencies.

Channel Separation: 90 dB

Excellent channel separation minimizes crosstalk between audio channels, resulting in clearer and more defined sound reproduction.

Harmonic Distortion: 0.01 %

Low harmonic distortion ensures faithful sound reproduction, making it an ideal choice for high-fidelity audio applications.

Power Supplies (V): 9

Utilizing a standard power supply voltage of 9V simplifies integration as it fits commonly available power sources.

No. of Terminals: 42

A high number of terminals allows for versatile connectivity options, supporting complex circuit configurations.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line shrink pitch style helps in saving PCB space while providing a robust connection.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the IC is suitable for a wide range of operating environments.

No. of Bands: 3

Three bands provide sufficient control over audio frequencies, enabling enhanced audio customization and quality.

Minimum Operating Temperature: -10 °C

The ability to operate in temperatures as low as -10 °C ensures reliability in colder environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and protects against oxidation, improving overall reliability.

Terminal Position: DUAL

Dual terminal positions facilitate easier placement on PCBs, leading to more efficient design and assembly processes.

Maximum Seated Height: 5.08 mm

A compact seated height allows for a low-profile design, supporting space-constrained applications.

Width: 15.24 mm

A width of 15.24 mm provides a balanced footprint that is common and easy to incorporate into various designs.

Minimum Supply Voltage (Vsup): 7 V

Operates with a minimum supply voltage of 7V, making it flexible for various power supply scenarios.

Length: 36.83 mm

The length of 36.83 mm offers a compact form factor, optimizing space in both traditional and modern PCB layouts.

No. of Channels: 2

Having two channels allows for stereo sound processing, which is essential for quality audio applications.

Technology: BICMOS

The BICMOS technology combines the advantages of bipolar and CMOS, leading to high performance with low power consumption.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical and electrical connections, making them ideal for various mounting options.

Terminal Pitch: 1.778 mm

The terminal pitch of 1.778 mm is suitable for most standard PCB designs, facilitating easy integration and assembly.

Maximum Supply Voltage (Vsup): 10.2 V

The capability to operate at a maximum supply voltage of 10.2V allows more headroom for dynamic audio performance.

Technical Specifications

Audio Control ICs TDA7466 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDIP-T42

JESD-609 Code:

e3

Length:

36.83 mm

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP42,.6

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TDA7466 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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