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TPA0232PWPG4

Texas Instruments

TPA0232PWPG4 by Texas Instruments

TPA0232PWPG4 by Texas Instruments is an Audio Control IC with 2 channels, CMOS technology, and 10% harmonic distortion. It operates b/w -40 to 85°C, requires a supply voltage of 4.5-5.5V, and has a max current draw of 15mA. Ideal for volume control circuits in industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,425 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,425

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-

-

-

Digiode

USA . 2,342 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,342

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 207 parts In-Stock

1+ parts

$2.063

100+ parts

-

1k+ parts

$2.584

10k+ parts

-

207

$2.063

-

$2.584

-

ChromeModa Solutions

Germany . 3,365 parts In-Stock

1+ parts

$2.318

100+ parts

$1.901

1k+ parts

-

10k+ parts

-

3,365

$2.318

$1.901

-

-

IDEA Electronic Components Group

UK . 98 parts In-Stock

1+ parts

$2.318

100+ parts

-

1k+ parts

$2.086

10k+ parts

-

98

$2.318

-

$2.086

-

AZTECH Wire

Italy . 476 parts In-Stock

1+ parts

$10.975

100+ parts

-

1k+ parts

-

10k+ parts

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476

$10.975

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-

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One Stop Electronics

USA . 467 parts In-Stock

1+ parts

$14.800

100+ parts

-

1k+ parts

-

10k+ parts

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467

$14.800

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-

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Corphita

USA . 3,323 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,323

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DigiPath Technology Company

USA . 1,495 parts In-Stock

1+ parts

-

100+ parts

$2.090

1k+ parts

-

10k+ parts

-

1,495

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$2.090

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Overview

Experience superior audio control with the TPA0232PWPG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This audio control IC is perfect for a wide range of applications, offering unparalleled value and benefits to customers. Enhance your audio systems with ease and precision using the TPA0232PWPG4, designed to provide optimal performance and efficiency. Level up your audio experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on circuit boards.

General IC Type: VOLUME CONTROL CIRCUIT

Specifically designed for volume control circuits, ensuring optimal performance in audio control applications.

Power Supplies (V): 5

Operates on a 5V power supply, making it compatible with standard voltage levels in electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range (-40 to 85°C) ensures reliable operation in harsh environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient performance.

No. of Channels: 2

Dual-channel design allows for independent control of audio volume for multiple channels.

Technical Specifications

Audio Control ICs TPA0232PWPG4 attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Bands:

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TPA0232PWPG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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