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LM4811LD/NOPB

Texas Instruments

LM4811LD/NOPB by Texas Instruments

LM4811LD/NOPB by Texas Instruments is a volume control circuit with 100 dB channel separation, suitable for industrial applications. It operates on power supplies of 2.6-5V, has a small outline package style, and features dual terminal position for easy installation in audio control systems.

Median Price

$0.607

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 77,000 parts In-Stock

1+ parts

-

100+ parts

$0.596

1k+ parts

$0.495

10k+ parts

$0.441

77,000

-

$0.596

$0.495

$0.441

Verical

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.618

10k+ parts

$0.551

50,000

-

-

$0.618

$0.551

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 407 parts In-Stock

1+ parts

$0.463

100+ parts

-

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407

$0.463

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-

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Vyrian

USA . 2,282 parts In-Stock

1+ parts

$0.487

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-

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2,282

$0.487

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Anansix

USA . 1,210 parts In-Stock

1+ parts

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1,210

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ACDS - Activité Composants Distribution Service

France . 789 parts In-Stock

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789

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Distributors (Availability)

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Corphita

USA . 4,541 parts In-Stock

1+ parts

$0.438

100+ parts

-

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4,541

$0.438

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-

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Vigor

Singapore . 76,000 parts In-Stock

1+ parts

$0.470

100+ parts

-

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76,000

$0.470

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Parana Technologies

USA . 2,272 parts In-Stock

1+ parts

$2.429

100+ parts

-

1k+ parts

$2.924

10k+ parts

-

2,272

$2.429

-

$2.924

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DigiPath Technology Company

USA . 2,023 parts In-Stock

1+ parts

$2.674

100+ parts

$2.460

1k+ parts

-

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2,023

$2.674

$2.460

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ChromeModa Solutions

Germany . 3,477 parts In-Stock

1+ parts

$2.729

100+ parts

$2.238

1k+ parts

-

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3,477

$2.729

$2.238

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IDEA Electronic Components Group

UK . 646 parts In-Stock

1+ parts

$2.729

100+ parts

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1k+ parts

$2.456

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646

$2.729

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$2.456

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Perfect Parts

USA . 267,566 parts In-Stock

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267,566

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Metaverse IC Inc.

Canada . 230,893 parts In-Stock

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,797 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,363 parts In-Stock

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5,363

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Alle Elektronik GmbH

Germany . 3,575 parts In-Stock

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3,575

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Cyclops Electronics Ltd (Excess)

UK . 2,809 parts In-Stock

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2,809

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Microchip USA

USA . 2,421 parts In-Stock

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2,421

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Overview

Enhance your audio experience with the LM4811LD/NOPB by Texas Instruments, a top-notch Audio Control IC that delivers unparalleled quality and reliability. Manufactured by a trusted name in the industry, this product is perfect for a wide range of applications in various electronic devices. With its advanced features and compact design, this Volume Control Circuit ensures optimum performance and efficiency. Elevate your sound system to new heights with the LM4811LD/NOPB – the ultimate solution for all your audio control needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto PCBs, making it a convenient choice for manufacturers.

Package Shape: SQUARE

The square package shape provides a compact design that can easily fit into tight spaces, making it versatile for various audio control applications.

Channel Separation: 100 dB

High channel separation of 100 dB ensures clear and distinct audio signals for each channel, resulting in improved sound quality.

Power Supplies (V): 2.6/5

Support for dual power supplies at 2.6V and 5V allows for flexibility in power input options, making it suitable for a wide range of audio applications.

No. of Terminals: 10

Having 10 terminals provides ample connection points for various input and output channels, enhancing the versatility of the product in audio control circuits.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand demanding environmental conditions, ensuring reliability in operation.

Width: 3 mm

The compact width of 3 mm allows for space-efficient placement on PCBs, making it suitable for compact audio control circuit designs.

Minimum Supply Voltage (Vsup): 2 V

Support for a low minimum supply voltage of 2V enables energy-efficient operation, making it suitable for portable and low-power audio devices.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature requirements, ensuring stable operation in harsh industrial environments, making it a reliable choice for industrial audio control applications.

No. of Channels: 2

Support for 2 channels allows for stereo audio control functionality, making it suitable for stereo systems and audio equipment that require dual-channel operation.

Technical Specifications

Audio Control ICs LM4811LD/NOPB attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

100 dB

General IC Type:

JESD-30 Code:

S-XDSO-N10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC10,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.6/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

LM4811LD/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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