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TPA6130A2YZH

Texas Instruments

TPA6130A2YZH by Texas Instruments

TPA6130A2YZH by Texas Instruments is a surface mount audio control IC with 1 function. It has a square package shape and 16 terminals in a grid array, very thin profile, fine pitch style. With an operating temperature range of -40 to 85 °C, it is commonly used for volume control circuits in industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,929 parts In-Stock

1+ parts

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6,929

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Digiode

USA . 1,117 parts In-Stock

1+ parts

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1,117

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

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700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,169 parts In-Stock

1+ parts

$1.660

100+ parts

-

1k+ parts

$2.269

10k+ parts

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1,169

$1.660

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$2.269

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DigiPath Technology Company

USA . 291 parts In-Stock

1+ parts

$1.828

100+ parts

$1.681

1k+ parts

-

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291

$1.828

$1.681

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ChromeModa Solutions

Germany . 3,994 parts In-Stock

1+ parts

$1.865

100+ parts

$1.529

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3,994

$1.865

$1.529

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IDEA Electronic Components Group

UK . 1,821 parts In-Stock

1+ parts

$1.865

100+ parts

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1k+ parts

$1.678

10k+ parts

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1,821

$1.865

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$1.678

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Ampacity Inc.

Singapore . 780 parts In-Stock

1+ parts

$8.800

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780

$8.800

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One Stop Electronics

USA . 946 parts In-Stock

1+ parts

$9.800

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946

$9.800

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AZTECH Wire

Italy . 405 parts In-Stock

1+ parts

$16.933

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405

$16.933

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Lixinc

USA . 3,398 parts In-Stock

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3,398

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Corphita

USA . 1,292 parts In-Stock

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1,292

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Experience crystal-clear sound like never before with the TPA6130A2YZH audio control IC by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The TPA6130A2YZH is perfect for various applications, offering precise volume control and seamless audio performance. With its compact size and surface mount capability, it fits seamlessly into any design. Whether you're a music enthusiast or a professional in need of high-fidelity audio, this IC delivers exceptional value, benefits, and advantages that will elevate your listening experience to new heights.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and labor costs.

Package Shape: SQUARE

Square package shape provides efficient use of space on the PCB, ideal for compact designs.

General IC Type: VOLUME CONTROL CIRCUIT

Specifically designed for volume control applications, ensuring optimal performance in audio systems.

Maximum Operating Temperature: 85 °C

Works reliably in high temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates effectively in low temperature conditions, providing versatility in usage.

Terminal Finish: TIN SILVER COPPER

Provides corrosion resistance and excellent conductivity for reliable connections.

Width: 2.29 mm

Compact width allows for space-saving integration in small electronic devices.

Minimum Supply Voltage (Vsup): 2.5 V

Operates efficiently with low supply voltage, suitable for battery-powered devices.

Temperature Grade: INDUSTRIAL

Industrial-grade quality ensures ruggedness and durability for demanding applications.

No. of Channels: 2

Dual channels provide stereo capabilities for enhanced audio performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables precise connections, reducing the risk of short circuits.

Maximum Supply Voltage (Vsup): 5.5 V

Supports higher supply voltage for increased compatibility with various power sources.

Technical Specifications

Audio Control ICs TPA6130A2YZH attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XBGA-B16

JESD-609 Code:

e1

Length:

2.29 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

2.29 mm

Trade Compliance

TPA6130A2YZH General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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