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LM4841MT

Texas Instruments

LM4841MT by Texas Instruments

LM4841MT by Texas Instruments is a Volume Control Circuit with 65 dB Channel Separation. It operates at 2.7-5.5V, suitable for industrial applications. This Audio Control IC has 2 channels, Gull Wing terminals, and a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,510 parts In-Stock

1+ parts

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8,510

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Digiode

USA . 885 parts In-Stock

1+ parts

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885

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Anansix

USA . 526 parts In-Stock

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526

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,124 parts In-Stock

1+ parts

$2.487

100+ parts

-

1k+ parts

$2.978

10k+ parts

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2,124

$2.487

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$2.978

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DigiPath Technology Company

USA . 1,387 parts In-Stock

1+ parts

$2.738

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1,387

$2.738

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ChromeModa Solutions

Germany . 5,872 parts In-Stock

1+ parts

$2.794

100+ parts

$2.291

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5,872

$2.794

$2.291

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IDEA Electronic Components Group

UK . 1,576 parts In-Stock

1+ parts

$2.794

100+ parts

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1k+ parts

$2.515

10k+ parts

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1,576

$2.794

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$2.515

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One Stop Electronics

USA . 449 parts In-Stock

1+ parts

$7.800

100+ parts

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449

$7.800

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AZTECH Wire

Italy . 288 parts In-Stock

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$11.927

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288

$11.927

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Corphita

USA . 1,929 parts In-Stock

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1,929

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Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

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1,500

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Overview

Enhance your audio experience with the LM4841MT by Texas Instruments. Crafted with precision and expertise, this Audio Control IC offers unmatched quality and performance. Whether you're in need of volume control or channel separation, this versatile product delivers exceptional results. Perfect for a wide range of applications, this compact IC provides reliable power supplies and efficient operation. Elevate your audio projects with the LM4841MT and enjoy the superior value, benefits, and advantages it brings to every customer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the IC, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards, saving time and effort during the manufacturing process.

Channel Separation: 65 dB

With a high channel separation of 65 dB, this IC can provide clear and distinct audio signals for each channel, resulting in improved sound quality and clarity.

No. of Terminals: 28

The abundance of 28 terminals provides flexibility in connecting the IC to other components, allowing for a wide range of system configurations and functionalities.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the IC can operate reliably and efficiently in a wide range of temperature conditions, making it suitable for industrial applications where temperature variations are common.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement of 2.7 V allows for compatibility with a variety of power sources, making this IC suitable for portable and low-power applications.

Technical Specifications

Audio Control ICs LM4841MT attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

65 dB

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

LM4841MT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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