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LC75412W

Onsemi

LC75412W by Onsemi

LC75412W by Onsemi is an Audio Control IC with 64 terminals in a square flatpack package. Operating temperature ranges from -40 to 85 °C, suitable for industrial applications. It operates at 9V power supply with max current of 60mA, utilizing CMOS technology for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,390 parts In-Stock

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Digiode

USA . 1,652 parts In-Stock

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Kulean Microsystems

USA . 4,448 parts In-Stock

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Problanco Electronics

Mexico . 4,256 parts In-Stock

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TANS Electronics

Latvia . 4,057 parts In-Stock

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SupplyDigital Components

Austria . 2,341 parts In-Stock

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Corphita

USA . 344 parts In-Stock

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Corohmni

South Africa . 203 parts In-Stock

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UHIMA Technologies

Türkiye . 98 parts In-Stock

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Overview

Experience the next level of audio control with the LC75412W by Onsemi. Manufactured with precision and expertise, this Audio Control IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides exceptional value with its innovative features and benefits. Enhance your audio systems with ease and efficiency, giving you a competitive edge in the market. Trust Onsemi to deliver cutting-edge technology that meets your audio control needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the IC, making it durable and reliable for long-term use.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Power Supplies (V): 9

Operating at 9V allows for compatibility with a wide range of power sources, making it versatile for different applications.

No. of Terminals: 64

Having 64 terminals provides ample connection options, allowing for flexibility in circuit design and connectivity.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this IC can withstand elevated temperatures, ensuring stable performance in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the IC to function reliably even in cold conditions, expanding its usability range.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency and reliability of the Audio Control IC.

Technical Specifications

Audio Control ICs LC75412W attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Maximum Supply Current:

60 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC75412W General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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