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LM4844TLX

Texas Instruments

LM4844TLX by Texas Instruments

LM4844TLX by Texas Instruments is a Volume Control Circuit with 84 dB Channel Separation. It features 2 Channels, operates b/w -40 to 85 °C, and has a Supply Voltage range of 2.7V to 5.5V. Ideal for audio applications requiring precise volume control in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,881 parts In-Stock

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7,881

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Anansix

USA . 1,564 parts In-Stock

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1,564

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Digiode

USA . 446 parts In-Stock

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446

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 597 parts In-Stock

1+ parts

$0.839

100+ parts

$77.939

1k+ parts

$0.755

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597

$0.839

$77.939

$0.755

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DigiPath Technology Company

USA . 2,187 parts In-Stock

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$0.924

100+ parts

$0.850

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2,187

$0.924

$0.850

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ChromeModa Solutions

Germany . 5,664 parts In-Stock

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$0.943

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$0.773

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$0.943

$0.773

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IDEA Electronic Components Group

UK . 206 parts In-Stock

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$0.943

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$0.849

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206

$0.943

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$0.849

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AZTECH Wire

Italy . 654 parts In-Stock

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$5.825

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654

$5.825

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One Stop Electronics

USA . 847 parts In-Stock

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$19.800

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847

$19.800

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Lixinc

USA . 9,211 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,999 parts In-Stock

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Corphita

USA . 2,761 parts In-Stock

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Assy Fe

Spain . 2,551 parts In-Stock

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Kepictronics

USA . 2,246 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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Overview

Enhance the audio experience with the LM4844TLX by Texas Instruments. Designed with precision and reliability in mind, this Audio Control IC offers unparalleled quality and performance. Perfect for a wide range of applications, this product provides crystal-clear sound and seamless volume control. With Texas Instruments' renowned reputation for innovation and excellence, you can trust that this product delivers exceptional value and benefits. Upgrade your audio systems today with the LM4844TLX and enjoy superior sound quality like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making this product suitable for mass production and compact designs.

Channel Separation: 84 dB

High channel separation ensures clear and distinct audio signals, providing a high-quality listening experience.

No. of Terminals: 30

Having a sufficient number of terminals allows for versatile connections and integration with other components in a system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance.

Minimum Operating Temperature: -40 °C

A wide range of operating temperatures allows for use in various environments, making this product suitable for different applications.

Width: 2.54 mm

The compact width of the package saves space on the circuit board and enables the design of smaller and more portable devices.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources, making this product versatile and easy to integrate.

No. of Channels: 2

Having two channels allows for stereo audio output, providing a more immersive listening experience compared to single-channel designs.

Technical Specifications

Audio Control ICs LM4844TLX attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

84 dB

General IC Type:

JESD-30 Code:

R-XBGA-B30

JESD-609 Code:

e0

Length:

2.949 mm

Moisture Sensitivity Level (MSL):

1

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

2.54 mm

Trade Compliance

LM4844TLX General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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