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LM4949TL

Texas Instruments

LM4949TL by Texas Instruments

LM4949TL by Texas Instruments is a square-shaped audio amplifier IC with 25 terminals in a grid array package. It offers 2.5W nominal output power, operates b/w -40 to 85°C, and supports a supply voltage range of 2.7V to 5.5V. Ideal for industrial applications requiring high-quality audio amplification in compact devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,750 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,750

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Vyrian

USA . 2,944 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,944

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Anansix

USA . 853 parts In-Stock

1+ parts

-

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853

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 681 parts In-Stock

1+ parts

$2.526

100+ parts

$234.561

1k+ parts

$2.273

10k+ parts

-

681

$2.526

$234.561

$2.273

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DigiPath Technology Company

USA . 570 parts In-Stock

1+ parts

$2.781

100+ parts

-

1k+ parts

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10k+ parts

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570

$2.781

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One Stop Electronics

USA . 309 parts In-Stock

1+ parts

$2.800

100+ parts

-

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309

$2.800

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ChromeModa Solutions

Germany . 4,159 parts In-Stock

1+ parts

$2.838

100+ parts

$2.327

1k+ parts

-

10k+ parts

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4,159

$2.838

$2.327

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IDEA Electronic Components Group

UK . 1,601 parts In-Stock

1+ parts

$2.838

100+ parts

-

1k+ parts

$2.554

10k+ parts

-

1,601

$2.838

-

$2.554

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AZTECH Wire

Italy . 870 parts In-Stock

1+ parts

$17.627

100+ parts

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870

$17.627

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Corphita

USA . 3,520 parts In-Stock

1+ parts

-

100+ parts

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3,520

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Kepictronics

USA . 750 parts In-Stock

1+ parts

-

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750

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Overview

Enhance your audio experience with the LM4949TL by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality audio control ICs that are perfect for a wide range of applications. Whether you're looking to upgrade your sound system or enhance your electronic device, the LM4949TL offers unparalleled performance and reliability. With its compact size and advanced features, this audio amplifier provides 2.5W of power while maintaining a very thin profile. Trust Texas Instruments to bring you the best in audio technology.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort in manufacturing.

Package Shape: SQUARE

Compact shape allows for efficient use of space on circuit boards, ideal for applications with limited space.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification applications, ensuring high-quality sound output.

Nominal Output Power: 2.5 W

Provides sufficient power for driving speakers in audio systems, delivering clear and loud sound.

Minimum Supply Voltage (Vsup): 2.7 V

Operates at low voltage, making it suitable for battery-powered devices and energy-efficient applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring stability and reliability in various environmental conditions.

No. of Channels: 2

Supports dual-channel audio output, allowing for stereo sound reproduction for an immersive listening experience.

Technical Specifications

Audio Control ICs LM4949TL attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

S-XBGA-B25

JESD-609 Code:

e1

Length:

2.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

2.5 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

2.7 mm

Trade Compliance

LM4949TL General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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