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TDA7449D

STMicroelectronics

TDA7449D by STMicroelectronics

TDA7449D by STMicroelectronics is a BICMOS audio control IC designed for tone control applications. It features 100 dB channel separation, 0.01% harmonic distortion, and operates b/w 6-10.2 V. Ideal for compact audio systems, it ensures high-quality sound performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,554 parts In-Stock

1+ parts

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4,554

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Digiode

USA . 1,883 parts In-Stock

1+ parts

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1,883

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Anansix

USA . 425 parts In-Stock

1+ parts

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425

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 859 parts In-Stock

1+ parts

$1.276

100+ parts

-

1k+ parts

$1.148

10k+ parts

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859

$1.276

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$1.148

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MKK Technologies

India . 1,067 parts In-Stock

1+ parts

$2.400

100+ parts

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1,067

$2.400

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DigiPath Technology Company

USA . 1,067 parts In-Stock

1+ parts

$2.400

100+ parts

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1,067

$2.400

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Corphita

USA . 3,331 parts In-Stock

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3,331

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Parana Technologies

USA . 1,301 parts In-Stock

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100+ parts

$1.526

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1,301

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$1.526

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Overview

Unlock a new realm of audio excellence with the TDA7449D from STMicroelectronics, renowned for its commitment to innovation and quality. This advanced audio control IC elevates your sound experience, offering crystal-clear performance and superior tone control. Ideal for high-fidelity applications, it effortlessly enhances music systems, TVs, and more. With ST's legacy of reliability, you gain not just a component but a pathway to auditory perfection that captivates every listener. Elevate your project today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent protection against environmental factors, ensuring the longevity of the IC.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and smoother manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape is conducive for compact layouts, making it easier to integrate into various audio applications.

General IC Type: TONE CONTROL CIRCUIT

This IC is specifically designed for tone control, making it ideal for enhancing audio systems and improving sound quality.

Channel Separation: 100 dB

Excellent channel separation ensures minimal interference between audio channels, resulting in clearer and more immersive sound.

Harmonic Distortion: 0.01 %

Low harmonic distortion means that the audio output maintains its original quality, providing a more accurate sound reproduction.

Power Supplies (V): 9

A standard voltage of 9V makes it compatible with a wide range of audio applications, ensuring versatility.

No. of Terminals: 20

With multiple terminals, this IC allows for greater connectivity and integration in complex audio circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes PCB space usage, enabling compact designs for modern audio systems.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures that this IC can function reliably in warmer environments.

No. of Bands: 2

Having two bands allows for adjustment of both the bass and treble, offering flexible equalization options for users.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this IC is suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality finish on the terminals ensures excellent conductivity and resistance to corrosion, enhancing reliability.

Terminal Position: DUAL

Dual terminal positioning allows for easier integration into dual-channel systems, promoting better layout flexibility.

Maximum Seated Height: 2.65 mm

A low seated height supports compact designs, enabling placement in smaller audio devices.

Width: 7.5 mm

Compact width supports space-efficient circuit designs, making it suitable for various audio applications.

Minimum Supply Voltage (Vsup): 6 V

A low minimum supply voltage requirement allows for battery-operated designs, improving product versatility.

Length: 12.8 mm

The modest length aids in achieving space-efficient layouts, crucial for modern electronic devices.

Temperature Grade: COMMERCIAL

This commercial-grade temperature classification ensures reliable performance in typical operating conditions.

No. of Channels: 2

Supporting two channels provides stereo functionality, essential for delivering a high-quality audio experience.

Technology: BICMOS

The BICMOS technology combines the advantages of bipolar and CMOS transistors, enhancing performance and reducing power consumption.

Terminal Form: GULL WING

The gull wing terminal form is designed for easy soldering and ensures reliable connections in surface mount applications.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch strikes a good balance between compactness and ease of soldering.

Maximum Supply Voltage (Vsup): 10.2 V

The higher maximum supply voltage expands the range of compatible power supplies, allowing for more powerful applications.

Technical Specifications

Audio Control ICs TDA7449D attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7449D General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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