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TDA7437T

STMicroelectronics

TDA7437T by STMicroelectronics

TDA7437T by STMicroelectronics is a BICMOS audio control IC designed for tone control applications. It features 95 dB channel separation, 0.01% harmonic distortion, and operates within a supply voltage range of 6-10.2 V. Ideal for industrial audio systems, it ensures high-quality sound performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,842 parts In-Stock

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3,842

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Cyclops Electronics Ltd

UK . 2,778 parts In-Stock

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2,778

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Anansix

USA . 2,677 parts In-Stock

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2,677

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Lighthouse Electronics, Inc.

USA . 1,280 parts In-Stock

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1,280

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Vyrian

USA . 144 parts In-Stock

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144

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Sogenti Electronics

Canada . 137 parts In-Stock

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137

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 118 parts In-Stock

1+ parts

$0.653

100+ parts

-

1k+ parts

$0.588

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-

118

$0.653

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$0.588

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MKK Technologies

India . 1,728 parts In-Stock

1+ parts

$1.228

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1,728

$1.228

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DigiPath Technology Company

USA . 1,728 parts In-Stock

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$1.228

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1,728

$1.228

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$4.310

100+ parts

$4.267

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$4.095

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100

$4.310

$4.267

$4.095

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Kepictronics

USA . 4,350 parts In-Stock

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4,350

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GreenTree Electronics

Israel . 2,778 parts In-Stock

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2,778

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Parana Technologies

USA . 2,142 parts In-Stock

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$0.781

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2,142

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$0.781

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Corphita

USA . 97 parts In-Stock

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97

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Overview

Elevate your audio experience with the TDA7437T from STMicroelectronics, a leader in cutting-edge technology. This premium audio control IC delivers exceptional sound quality and unparalleled performance, making it ideal for diverse applications—from home audio systems to automotive entertainment. With precise tone control and remarkable channel separation, enjoy crystal-clear sound like never before. Trust in STMicroelectronics' commitment to innovation and reliability for all your audio needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection for the internal components, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration into modern electronic devices.

Package Shape: SQUARE

The square package shape facilitates efficient use of PCB real estate, aiding in compact circuit design.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit IC, it offers advanced audio processing capabilities, enhancing sound quality in audio equipment.

Channel Separation: 95 dB

High channel separation minimizes crosstalk, ensuring clear, distinct audio channels, which is ideal for high-fidelity audio applications.

Harmonic Distortion: 0.01 %

Low harmonic distortion means cleaner audio output, making it a perfect choice for high-quality audio systems.

Power Supplies (V): 9

Designed for a standard 9V supply, it is compatible with a wide range of audio applications.

No. of Terminals: 44

A higher number of terminals allows for greater functionality and versatility in connections.

Package Style (Meter): FLATPACK

Flatpack style helps in efficient space utilization on the PCB.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is reliable for use in environments where heat may be a concern.

No. of Bands: 3

Three-band control allows for precise adjustments of bass, midrange, and treble, enhancing user control over sound quality.

Minimum Operating Temperature: -40 °C

Its ability to operate at a low temperature ensures reliable performance even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish enhances solderability and ensures long-term reliability against corrosion.

Terminal Position: QUAD

Quad terminal positioning facilitates better layout flexibility in PCB design.

Maximum Seated Height: 2.45 mm

A low maximum seated height allows for a low-profile design, fitting into space-constrained applications.

Width: 10 mm

The 10 mm width strikes a balance between compact design and functional connectivity.

Minimum Supply Voltage (Vsup): 6 V

The lower minimum supply voltage makes it versatile for use in battery-powered or low-voltage applications.

Length: 10 mm

A compact 10 mm length contributes to an overall smaller design footprint on the PCB.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this IC can withstand harsh environments, making it robust for professional audio systems.

No. of Channels: 2

Two channels support stereo audio applications, essential for modern audio equipment.

Technology: BICMOS

BICMOS technology combines the benefits of both Bipolar and CMOS, leading to improved performance and reduced power consumption.

Terminal Form: GULL WING

Gull wing terminals allow for easier handling and soldering, improving manufacturing efficiency.

Maximum Supply Current: 13 mA

A maximum supply current of 13 mA implies low power consumption, making this IC energy-efficient.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is suitable for high-density PCBs, allowing for more compact designs.

Maximum Supply Voltage (Vsup): 10.2 V

The maximum supply voltage of 10.2 V allows for stable performance across various audio processing conditions.

Technical Specifications

Audio Control ICs TDA7437T attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

95 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

13 mA

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7437T General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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