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TDA7419TR

STMicroelectronics

TDA7419TR by STMicroelectronics

TDA7419TR by STMicroelectronics is a versatile audio control IC designed for tone control applications. It features 90 dB channel separation, operates b/w 8-10 V, and supports industrial temperature ranges from -40 °C to 85 °C. Ideal for high-quality audio systems, it ensures precise sound management.

Median Price

$4.440

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 729 parts In-Stock

1+ parts

$4.440

100+ parts

$3.269

1k+ parts

$2.783

10k+ parts

-

729

$4.440

$3.269

$2.783

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,640 parts In-Stock

1+ parts

$4.218

100+ parts

-

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4,640

$4.218

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Chip Stock

USA . 18,500 parts In-Stock

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18,500

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Vyrian

USA . 3,078 parts In-Stock

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3,078

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Anansix

USA . 1,264 parts In-Stock

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1,264

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A&K Electronics

USA . 100 parts In-Stock

1+ parts

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100

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Rotakorn

Sweden . 100 parts In-Stock

1+ parts

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100

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Bristol Electronics

USA . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 160 parts In-Stock

1+ parts

$0.899

100+ parts

-

1k+ parts

$0.809

10k+ parts

-

160

$0.899

-

$0.809

-

MKK Technologies

India . 1,373 parts In-Stock

1+ parts

$1.690

100+ parts

-

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1,373

$1.690

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DigiPath Technology Company

USA . 1,373 parts In-Stock

1+ parts

$1.690

100+ parts

-

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1,373

$1.690

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Component Stockers USA

USA . 4,046 parts In-Stock

1+ parts

$2.440

100+ parts

$2.320

1k+ parts

$2.240

10k+ parts

-

4,046

$2.440

$2.320

$2.240

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Corphita

USA . 2,394 parts In-Stock

1+ parts

$3.996

100+ parts

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2,394

$3.996

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Microchip USA

USA . 3,021 parts In-Stock

1+ parts

$16.946

100+ parts

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3,021

$16.946

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A-Z Elektronik GmbH

Germany . 7,257 parts In-Stock

1+ parts

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7,257

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Lixinc

USA . 6,961 parts In-Stock

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6,961

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RC Electronics

USA . 5,210 parts In-Stock

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5,210

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Parana Technologies

USA . 2,310 parts In-Stock

1+ parts

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100+ parts

$1.075

1k+ parts

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2,310

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$1.075

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Perfect Parts

USA . 1,891 parts In-Stock

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1,891

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ChipstoGo Electronic ltd

UK . 234 parts In-Stock

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234

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Overview

Elevate your audio experience with the TDA7419TR from STMicroelectronics, a leader in innovation and reliability. This advanced audio control IC ensures pristine sound quality with exceptional channel separation, making it ideal for high-performance applications. Its compact design suits a variety of devices, bringing rich, customizable tone control into any project. Trust STMicroelectronics for unmatched performance and durability, enhancing both user satisfaction and product value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and excellent performance, making the product suitable for various audio applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier assembly in modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, facilitating better layout and integration.

General IC Type: TONE CONTROL CIRCUIT

Designed specifically for tone control, this IC provides effective audio signal enhancement, ensuring superior sound quality.

Channel Separation: 90 dB

High channel separation minimizes crosstalk, providing superior audio clarity and a more immersive listening experience.

Power Supplies (V): 8.5

Operating at a nominal voltage of 8.5 V ensures compatibility with a wide range of audio applications.

No. of Terminals: 28

With 28 terminals, this IC supports multiple connections, allowing for versatile implementation in complex audio systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained designs and helps improve thermal performance.

Maximum Operating Temperature: 85 °C

This high maximum operating temperature ensures reliable performance in demanding environments.

No. of Bands: 3

With three bands of tone control, this IC gives users significant flexibility in adjusting audio output to their preferences.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this IC suitable for industrial and outdoor applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and improves the overall reliability of connections.

Terminal Position: DUAL

Dual terminal positioning provides design flexibility, supporting a variety of PCB layouts.

Maximum Seated Height: 2.65 mm

A low maximum seated height aids in the design of thin devices, allowing for more compact audio solutions.

Width: 7.5 mm

A narrow width allows for a more compact PCB layout, supporting modern design requirements.

Minimum Supply Voltage (Vsup): 8 V

This minimum supply voltage ensures compatibility with a wide range of power sources while maintaining performance.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds supports robust soldering processes and enhances manufacturing efficiency.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C helps ensure reliable solder joint formation, critical for high-quality audio signals.

Length: 17.9 mm

A compact length contributes to the small form factor of audio devices, providing design versatility.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this IC is built to withstand harsh operating conditions, ensuring longevity.

No. of Channels: 2

Having two channels allows for stereo sound support, essential for high fidelity audio applications.

Technology: BICMOS

BICMOS technology combines the strengths of bipolar and CMOS, offering high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and facilitate easy soldering, enhancing manufacturability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many applications, making the IC compatible with various PCBs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating allows for a moderate exposure to moisture, ensuring reliability during assembly processes.

Maximum Supply Voltage (Vsup): 10 V

The maximum supply voltage of 10 V supports higher power applications, enabling greater audio performance.

Technical Specifications

Audio Control ICs TDA7419TR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

8.5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TDA7419TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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