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E-TDA7409D

STMicroelectronics

E-TDA7409D by STMicroelectronics

E-TDA7409D by STMicroelectronics is a versatile audio control IC designed for tone control applications. It features 100 dB channel separation, 0.005% harmonic distortion, and operates within -40 °C to 85°C. Ideal for industrial audio systems, it ensures high-quality sound performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,246 parts In-Stock

1+ parts

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5,246

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Anansix

USA . 1,578 parts In-Stock

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1,578

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Digiode

USA . 106 parts In-Stock

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106

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 907 parts In-Stock

1+ parts

$0.193

100+ parts

-

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10k+ parts

$0.185

907

$0.193

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$0.185

Northwest PG Solutions

USA . 160 parts In-Stock

1+ parts

$0.212

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-

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$0.187

160

$0.212

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$0.187

IDEA Electronic Components Group

UK . 623 parts In-Stock

1+ parts

$1.879

100+ parts

-

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$1.691

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623

$1.879

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$1.691

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MKK Technologies

India . 23 parts In-Stock

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$3.533

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23

$3.533

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DigiPath Technology Company

USA . 23 parts In-Stock

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$3.533

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23

$3.533

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Microchip USA

USA . 378 parts In-Stock

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$4.083

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378

$4.083

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AZTECH Wire

Italy . 951 parts In-Stock

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$22.130

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951

$22.130

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Corphita

USA . 4,431 parts In-Stock

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4,431

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Parana Technologies

USA . 1,653 parts In-Stock

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$2.246

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1,653

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$2.246

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Overview

Elevate your audio experience with the E-TDA7409D from STMicroelectronics, a leader in innovative semiconductor solutions. This premium audio control IC is designed for optimal sound quality and precision, making it perfect for high-end audio systems, professional mixers, and home theater setups. With exceptional channel separation and low distortion, enjoy crystal-clear audio while benefiting from ST's commitment to reliability and cutting-edge technology. Embrace superior sound and performance today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and cost-effectiveness, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact PCB designs and efficient assembly processes, leading to reduced manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape aids in easy integration into existing designs and optimal space utilization on the PCB.

General IC Type: TONE CONTROL CIRCUIT

Tone control circuits enhance audio quality, making this IC ideal for audio applications where sound customization is crucial.

Channel Separation: 100 dB

High channel separation ensures clear and distinct audio signals, reducing crosstalk and improving overall sound clarity.

Harmonic Distortion: 0.005 %

Minimal harmonic distortion translates to high-fidelity audio reproduction, crucial for professional audio equipment.

No. of Terminals: 20

A sufficient number of terminals allows for versatile connectivity options and design flexibility in various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-efficient, making it easier to fit into compact designs and portable devices.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliable performance in demanding environments, suitable for industrial applications.

No. of Bands: 2

Having two bands allows for improved sound modulation and fine-tuning of audio output, enhancing user experience.

Minimum Operating Temperature: -40 °C

A wide operating temperature range makes this IC ideal for harsh environments, ensuring consistent performance in extreme conditions.

Terminal Position: DUAL

Dual terminal positions enhance the design flexibility and layout options on the PCB, facilitating easier integration.

Maximum Seated Height: 2.65 mm

A low seated height contributes to space-saving designs without compromising performance, perfect for compact applications.

Width: 7.5 mm

A moderate width allows for easy handling and integration into existing PCBs without layout challenges.

Minimum Supply Voltage (Vsup): 7.5 V

A minimum supply voltage of 7.5 V ensures compatibility with a wide range of power supply systems, enhancing design versatility.

Length: 12.8 mm

An optimal length aids in compact design and efficient layout on PCBs, facilitating easier placement in compact devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade guarantees reliability and stable performance in challenging environments.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS, providing high speed and low power consumption for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form enhances soldering ease and provides strong mechanical stability on the PCB, ensuring durability.

Terminal Pitch: 1.27 mm

This terminal pitch enables high-density layouts, maximizing space utilization on the PCB.

Maximum Supply Voltage (Vsup): 10.5 V

A maximum supply voltage of 10.5 V offers flexibility in system design, accommodating a variety of power supply configurations.

Technical Specifications

Audio Control ICs E-TDA7409D attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.005 %

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Bands:

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

10.5 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

E-TDA7409D General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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